TOSHIBA seemed to have continued to develop SiC MOSFET with Embedded Schottky Barrier Diode (SBD) products. From a 2022 press release:
KAWASAKI, Japan--(BUSINESS WIRE)-- Toshiba Electronic Devices & Storage Corporation and Toshiba Corporation (collectively “Toshiba”) have developed an SiC metal oxide semiconductor field effect transistor (MOSFET) that arranges embedded Schottky barrier diodes (SBD) in a check pattern (check-pattern embedded SBD) to realize both low on-resistance and high reliability. Toshiba has confirmed that the design secures an approximately 20% reduction in on-resistance (RonA) against its current SiC MOSFET, with no loss of reliability.
The 3rd generation SiC MOSFETs that contributes to lower loss of power supply in application article contains:
Therefore, our 3rd generation SiC MOSFETs have the following features.
- Built-in Schottky barrier diode (SBD) reduced the forward voltage VDSF , and suppresses fluctuation in on-resistance RDS(ON)
I.e. there have now been 3 generations of products.
From the TW015N120C datasheet:
Features:
- Chip design of 3rd generation (Built-in SiC schottky barrier diode)
- Low diode forward voltage: VDSF = -1.35 V (typ.)
- High voltage: VDSS = 1200 V
The TOSHIBA Selection Guide 2024 MOSFETs section 3. MOSFET with Diode has 9 devices, so appears to be an active product range.