Thermal stress:
A mechanical stress can be induced by thermal cycling. A difference in thermal expansion coefficient on neighboring layers in the assembly of the component can result in shear stress, that affect the integrity of the transistor. The paper “Towards Prognostics of Power MOSFETs: Accelerated Aging and Precursors of Failure” from NASA [2] reports an increase of Rds_on with temperature and aging, but does not report a change in capacitance.
Electrical stress:
The document “Physics-of-Failure Approach to Prognostic” from NASA [3], presents the results of an electrical stress on the transistor gate, created in high-current conditions. The failure mode is an increasing threshold voltage, until the failure becomes irreversible (see page 35). No impact on the output capacitance is identified.
According to “Transistor Aging” from the IEEE [4], this effect is explained by hot carriers injections. This mechanism charges the metal oxide layer with carriers, which increases the threshold voltage (Vth). The physical structure of the transistor is not affected, and therefore would not have a significant impact on the capacitance.
[2] “Towards Prognostics of Power MOSFETs: Accelerated Aging and Precursors of Failure” NASA. https://ntrs.nasa.gov/api/citations/20110014227/downloads/20110014227.pdf
[3] “Physics-of-Failure Approach to Prognostics” NASA. https://ntrs.nasa.gov/api/citations/20170011538/downloads/20170011538.pdf
[4] “Transistor Aging” IEEE. https://spectrum.ieee.org/transistor-aging
Lifetime drift conclusion:
The output capacitance of the solid state relays are defined by the physical dimensions of the transistors making up the component, and no aging mechanism is identified that will affect this.
There is therefore no expected impact of aging on the output capacitance or the threshold at which the impedance error will be detected.