I am working on a project where i will be laying out some traces that will be handling Gigabit Ethernet traffic. I know that putting these traces on the outside layers (Top or Bottom) is a bad idea, with noise and other EMI issues, but what other issues should i be concerned with?
I'm assuming that the trace width will be a factor, the board in question is currently 4 layers, standard 1.6mm thick FR4 with 1oz copper thickness on top/bottom with 0.5oz copper thickness for the internal traces.
There are two pairs of TX+ TX- and RX+ RX- for gigabit, should all four of these pairs be routed on the same internal layer, or should i route them on separate layers, for example TX1+ TX1- and RX1+ RX1- on layer 2 and TX2+ TX2- and RX2+ RX2- on layer 3?
How should i run grounds around these signals, between each signal, around the block of signals, and should i put ground planes above and below these traces?
Also, i probably shouldn't run the traces directly from the MCU to the connector, but I'm not really sure about what sort of inductors or coils i should use. By the way, the connector is about 10cm away from the MCU.