I've ordered two stencils from two different companies, two different materials. Both times I've been completely unable to effectively apply solder paste to the pads of a QFP-64. I end up with a mess of solder all along one side, instead of a discrete amount of paste on each pad. Applying more pressure to the stencil or to the squeegee does not seem to help. I suspect I'm simply doing something wrong, perhaps missing some vital piece of equipment everyone assumes I have for stencil work, or I'm pushing stencils past their reasonable limits.
Can someone explain to me how I can, by hand, repeatedly and consistently, apply solder paste to a QFP-64 footprint through a stencil, without bridges? Or if that's not possible, what's the next best thing?