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This question already has an answer here:

I have to design a board with a package case called MSOP-16

It has a large ground pad underneath the IC. What are good methods for soldering this pad by hand with a soldering iron?

Since it is a prototype, I was thinking to put a large enough via inside of the pad and to heat the via and drop solder through it from the other side after the outer pins have already been soldered.

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marked as duplicate by Leon Heller, Anindo Ghosh, Matt Young, Dave Tweed, Nick Alexeev Aug 29 '13 at 17:05

This question has been asked before and already has an answer. If those answers do not fully address your question, please ask a new question.

  • \$\begingroup\$ Yes, I did not see that question. Thanks for showing it. \$\endgroup\$ – EwokNightmares Aug 29 '13 at 13:27
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You can also use the Sparkfun "reflow skillet" method.

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