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I have to design a board with a package case called MSOP-16

It has a large ground pad underneath the IC. What are good methods for soldering this pad by hand with a soldering iron?

Since it is a prototype, I was thinking to put a large enough via inside of the pad and to heat the via and drop solder through it from the other side after the outer pins have already been soldered.

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  • \$\begingroup\$ Yes, I did not see that question. Thanks for showing it. \$\endgroup\$ Aug 29, 2013 at 13:27

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You can also use the Sparkfun "reflow skillet" method.

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