I have a QFN16 breadboard adapter and an ASXL335 chip, which I'd like to solder to it:
However, the accelerometer chip has a central pad, while board does not. This causes an annoying problem of soldering paste gathering under the pad and pushing the whole chip up (I have not expected this problem beforehand).
Is there any way to workaround this problem or is it futile? Will, for example, a small hole in the center help?
UPDATE: just to be clear. I do not need the pad as I am not concerned with thermal or physical strength issues (datasheet mentions the pad is there so accelerometer sits firmer to receive all those Gs it is supposed to measure). Also, I am using rework station fir this task.
UPDATE2: I've soldered it to the board after drilling a hole in the center and using less soldering paste. The device seems to have survived all these attempts. This time Z channel is not functioning, but X and Y do. Also, the picture was taken before adding GND-Vcc capacitor, as per datasheet.