Here is a core i7 cpu
It has some contact pads on the top side, some grouped in 4 or 6 and two big groups. Is there a pinout of these pads? Where are the JTAG connection pins?
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Your question can be easily answered with a continuity tester (which most voltmeters have). The below pinout is for an i3-540 (LGA1156). I connected one voltmeter probe to the jtag pad on the underside of the processor. Then I swept the other voltmeter probe across the top side of the processor until the voltmeter registered a continuity.
TOP SIDE OF PROCESSOR:
| 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | | |AL31* |BPM4 |BPM1 |BPM0 | |AL31* |TDO |TRST |PRDY |TAPPWRGD|AL31 | | | | |BPM6 |BPM7 |AL31 | |TCK |TDI |PREQ | | | | | | | |BPM5 |BPM3 |BPM2 |TMS | | | | | | | |
*Connected to BLCK_ITP# (useless since shorted) AL31 refers to Vss
CPU IS UPSIDE DOWN (ie Intel Made in Malaysia and S/n Upside down)
I will be interested if you could find the pinout for the i7 or perhaps we could reverse engineer the Intel JTAG protocol.
TAP is on the bottom side. AH10 TCK, AJ9 TDI, AJ10 TDO, AG10 TMS, AH9 TRST#
TCK I TCK (Test Clock) provides the clock input for the processor Test Bus (also known as the Test Access Port). TDI I TDI (Test Data In) transfers serial test data into the processor. TDI provides the serial input needed for JTAG specification support. TDO O TDO (Test Data Out) transfers serial test data out of the processor. TDO provides the serial output needed for JTAG specification support. TESTLOW I TESTLOW must be connected to ground through a resistor for proper processor operation. TMS I TMS (Test Mode Select) is a JTAG specification support signal used by debug tools. TRST# I TRST# (Test Reset) resets the Test Access Port (TAP) logic. TRST# must be driven low during power on Reset.
UPDATE: here are some adapters for i7: http://www.asset-intertech.com/products_interposers.htm
Intel® Core™ i7 processors and the Intel® Xeon® processor 5500 series use LGA1366 sockets, similar in design to the LGA775/771 sockets. However, the high speeds of these processors mean that the use of an interposer between the socket and the CPU could interfere with signal integrity. Intel has therefore provided pads on the top side of the CPU, which mirror the required signals. To access these top-side pads, ASSET has developed a top-side probe.
The LGA1366 top-side probe consists of a PCB with a ring connector attached below it that contains small, spring-loaded probe tips. These tips make contact with the CPU's top-side pads, allowing the debug port signals to be broken out onto a flexible cable, which terminates in a small PCB carrying a Intel®-specified XDP header. The standard socket load mechanism is used above the probe's PCB to depress the CPU into its socket. The heatsink and fan are mounted onto a heatsink location plate supplied with the probe.
Why do you want to do this? Do you know you need to provide this chip with about 1.1V @ 10 amps (up to 145 amps at full load) for it to even work, and that all signals have to be at this same level?
Likely, the pins are not documented. Here is the datasheet. The pins don't seem to be documented in that datasheet, and it's likely they are for factory specific testing (i.e. testing maximum operating frequency so they can bin chips into the various speed grades.)