I am making some new through-hole parts in Eagle for components that are not already in the various libraries. I've realized that the drill size needs to be a little larger than the lead diameter, but I'm not sure by how much.
- "It depends" based on whether the component is being hand or machine soldered
- add 6 mil to the lead diameter
- 7 to 15 mil (diametric gap) for 63/37 solder
- 5 to 10 mil (diametric gap) for lead-free/RoHS solder
Is there a rule of thumb or guide to support this information? Someone referred to the Industry Standard for Printed Board Design (IPC-2221), but the IPC apparently only provides the table of contents of the document unless you pay $100US.
I'm planning on soldering the components by hand using 63/37 solder.