I'm planning on using a thermal adhesive to bond an LED pcb to an aluminum enclosure. The enclosure is meant to serve as a heat sink and wick away any heat generated by the LED board. The aluminum enclosure has a curvature to it, which means that I cannot simply place the PCB flush against its surface. To that end I'm hoping to use a solution that will fill the gap between the two surfaces (at it's maximum the gap is roughly .063").
In the past I've used thermal pastes to help a heat sink wick away heat from an IC. I'd be inclined to use thermal paste, but it never quite hardens and I've found often "drips" away over time. That's generally fine if the chip/board is stationary, but in this case the entire enclosure moves often such that I can already see the thermal paste dripping off the board into some corner of the enclosure. Not to mention that with a .063" gap I can't imagine traditional thermal paste doing a good job here.
Google provided me with some basic info on thermal epoxies, but I've never used them and am wondering if anyone has experience with them. If so any advice/commentary? Are there any solutions that are "resettable" (e.g. can somehow break the bond and redo it)? Beyond epoxies are there solutions commonly used for this kind of stuff?