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I know that thermal reliefs have benefits when hand-soldering through-hole components.

For some high-frequency or high-current components, I understand why it's a good idea not to use thermal reliefs.

Is it a good practice to use thermal reliefs by default for all other SMD components?

How do they affect reflow soldering?

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For small components, 0603, 0402 and smaller, tombstone is a problem (One side of the component rises upwards due to temperature gradient), and a thermal relief can solve it.

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