6
\$\begingroup\$

I have come across a chip which is only available in LGA. I wouldn't touch BGA, but what about LGA? How possible is it to design for one with little experience? Are there any gotchas? I'm planning to reflow solder these using a hot plate.

\$\endgroup\$

3 Answers 3

Reset to default
7
\$\begingroup\$

LGA is similar to BGA, but without the solder balls, so you have to apply solder paste to the pads with a stencil. I don't think you will find them any easier to use than BGA.

\$\endgroup\$
4
  • \$\begingroup\$ Is it any comparison to QFN? \$\endgroup\$
    – Thomas O
    Feb 4, 2011 at 13:23
  • 1
    \$\begingroup\$ Quite different. I can solder QFN parts with a soldering station, quite easily. \$\endgroup\$
    – Leon Heller
    Feb 4, 2011 at 13:59
  • \$\begingroup\$ It's LGA pads/balls/whatever around the edges only though, which makes me draw a comparison to QFN. It's an LSM303 accelerometer / magnetometer. \$\endgroup\$
    – Thomas O
    Feb 4, 2011 at 17:15
  • 1
    \$\begingroup\$ that package looks like a cross between a QFN and a LGA. Basically its a QFN with leads that don't wrap around and are pushed in from the package edge just slightly. You won't be soldering that with an iron but i don't think it would be too difficult with a board heater and a hot air soldering unit. Or paste and a hot plate / baker. You shouldn't have the settling issues that would normally occur with a 'regular' LGA. \$\endgroup\$
    – Mark
    Feb 4, 2011 at 18:55
2
\$\begingroup\$

I've done LGA on a hot plate before, but only with a stencil. I wouldn't try it without a stencil. If this is a one-off, why not try the LSM303 breakout from Sparkfun?

\$\endgroup\$
2
  • \$\begingroup\$ Where do you get (or how do you make) your stencils? I imagine that you're not doing huge quantities if you're using a hot plate. \$\endgroup\$
    – Kevin Vermeer
    Feb 4, 2011 at 20:00
  • \$\begingroup\$ I etch my own stencils at home with a kit from Rena Electronics. \$\endgroup\$
    – krapht
    Feb 6, 2011 at 0:53
1
\$\begingroup\$

I've done an LGA without a stencil. But that was a small low pad count part (BMA180). I had to tin the pads with flux and solder, then placed the chip on top, then used hot air reflow to solder it.

\$\endgroup\$

Your Answer

By clicking “Post Your Answer”, you agree to our terms of service and acknowledge that you have read and understand our privacy policy and code of conduct.

Not the answer you're looking for? Browse other questions tagged or ask your own question.