Maybe someone has experience in this field.
I'd like to overmold a PCBA, which has SMT components, with a low pressure molding process. I am concerned about the temperature of the hotmelt material when it reaches the PCBA. The temperature should be between 200°C and 215°C.
Does anyone know if this material temperature could be a problem for the electronic components? Do I have the risk that the solder melts? Is this stress too harmful for the components?
I am not quite sure if the components will be able to withstand this temperature or if I should take as a reference the reflow temperatures of the components.