Questions tagged [bga]

Ball Grid Array - A type of chip packaging in which the "pins" or connections to the PCB is a series of small lands or pads which come prepared with small solder balls attached. When place upon the corresponding matching pattern on the PCB and subjected to solder reflow, the balls melt and form electrical and mechanical connections between the land on the package and the pad on the PCB. Characterized by attachment on the flat bottom of the package.

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54 views

How does PCB manufacture work for double sided SMT assembly with BGA's?

How does a conventional board house deal with the issue of reflow during PCB component assembly with BGA's on both sides of the board? Are two different solders used (like regular lead free SAC305 and ...
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Mediatek MT3333AV doesn't start

Recently I started a project with an MT3333AV GPS IC. I desoldered the chip from the L86 GPS module and put it into my project. After many tries I still can't start the IC. There is no 1.1 V going ...
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Decoupling capacitors for fine-pitch BGA on single-sided board

For a number of reasons I'm designing a 4-layer board with a fine-pitch BGA (400um). For some manufacturability reasons (the board must be mounted behind some other device) the bottom side of the ...
2 votes
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Moving BGA pads 0.01mm and making them smaller to work with JLCPCB capabilities

JLCPCB has requirements that mean some BGA packages can't be used because of minimum via size and minimum track spacing and sizes of pads to vis etc. To overcome this I came up with an idea that in ...
2 votes
1 answer
81 views

What's the purpose of these copper tracks on the bottom of BGA package?

These are STM32F746NGH6 microcontroller chips in .8 mm pitch BGA package. I noticed that there are copper tracks on the bottom of this chip, some of which lead to the edge of the chip and are left ...
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1 answer
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BGA reballing and reflowing, how to actually repair dead GPU chips?

To my understanding BGA reflowing is a technique which aims to reconnect bad solder joints on a BGA chip, BGA reballing is a technique to desolder and then resolder a BGA chip both aim to do the same ...
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Are there any resources on Column Last Attach Process? [closed]

I am trying to find resources about this process, but the only thing I have been able to find is the full form of the acronym CLAP any help is appreciated. This process is used vehemently in the ...
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Flux to lower solder ball melting point

Is there any such flux? I find the balls on BGAs very hard on my home made oven. From what I gather, mixing up solder types in order to lower the melting point is not the best idea, especially when ...
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16 votes
4 answers
2k views

Can leaded BGA chips be reflow soldered with lead-free process?

We have a board with two BGA chips. Due to the current shortage of many parts, one of the chips is next-to-impossible to find; except that we found a supplier with a good stock of the non-RoHS / ...
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BGA Stuff, unstuff PCB Pad Short

I am using Artix 7 FPGA (XC7A200T-2FPG676) BGA package on PCB, after unstuffing of FPGA I want to short two pad P18 and R18 on PCB with each other and then wants to stuff back my FPGA . Note: P18 and ...
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136 views

How do I remove this ring around the via?

I am wondering what this is this ring around the via and how do I remove it? I am using Altium 20.
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1 answer
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What are my options for packaging a WLCSP IC as a DIP?

Hypothetically, let's say I have a chip in a super small WLCSP or BGA package that I want to have packaged as a plastic or ceramic DIP. No extra components; just the pads brought out to pins. Are ...
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1 answer
136 views

Connect 2 BGA pins before soldering IC?

My first thought was it's not possible but I need a method that could potentially work, just for testing purposes. What I'm trying to do is the following: I forgot to breakout one BGA pin that I need ...
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Flux for removing LGA socket

I have been looking into the stackexchange searchbar and also I have been searching for a day or two globally, even the "similiar dialog on this website" when I was creating this post. I ...
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1 vote
1 answer
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Via on pad for bga decoupling. Is this ok when hand soldering?

I have understood that via on pad is bad for automatic assembly processes, but can be fine for hand soldering, since it is easy to compensate for the solder that wicks into the via. I am doing a small ...
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2 votes
1 answer
523 views

When should bare die be used instead of QFN/BGA packages?

I have no experience with bare die as a package, and I have been recently tasked with deciding between bare die, BGA, or QFN package for a SoC. Searching the internet, I have not really found much ...
2 votes
1 answer
1k views

Pros and Cons of QFN and BGA packages

As a PCB designer, is there a known list of advantages and disadvantages to using BGA vs. QFN packages? Here is the list I have discovered (please correct me if they are incorrect): BGA Pros: Smaller ...
3 votes
3 answers
794 views

Mounting BGA package on PCB with force without reflow

I was searching for a method to use a BGA based MCU on PCB which could be easier to change frequently. There are sockets for this purpose but I want to ask what if I simply put MCU on the right place ...
6 votes
2 answers
2k views

Is it possible to hand-solder a BGA without solder balls

In an attempt to fix a short circuit on a BGA package, I ended up making things worse. The BGA is desoldered with some of the balls left on the BGA, some on the PCB, and some gone entirely. I don't ...
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2 votes
1 answer
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BGA VCC and VSS shorted after desoldering

I am really confused with working with BGA chips. I am new to this but have been following other guides so I thought I should give it a try. I am using a DIY pre heater that has a 800watt IR bottom ...
0 votes
1 answer
149 views

Hole size of BGA stencil

I need to design a stencil for reballing. 0.76 is the diameter of the ball. What should be the size of each hole in the stencil? I was thinking about 0.8mm. Is that correct?
1 vote
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244 views

Thermal reliefs for via-in-pad under BGA?

I'm doing the layout of a high-speed (Multi gigabit) system based on an FPGA with more than a thousand BGA pads and 0.8mm pitch on a 10-layer board. I'm using via in pads that will be copper-filled ...
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1 vote
1 answer
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Trace width for breaking out 100Ω differential microstrip from 0.5mm pitch BGA

See bottom of post for the actual questions First, some context: I'm making a DisplayPort switch as a hobby project DisplayPort's high speed lines require 100Ω ± 10% differential impedance, which I'...
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Can I get underneath a BGA mounted chip?

I want to get to some pin signals on a mounted MCU, but it's a ball mounted / soldered one ... Is there way to 'hack' underneath it to get some signals out? Any usual home-lab setup people came up ...
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2 votes
2 answers
549 views

Why is eMMC in a BGA package, despite only using a small number of pins?

eMMC comes in BGA packages with many pins (100-200), yet it only uses a few of them (10-30). Why doesn't it come in a package with fewer pins instead, as wouldn't this be cheaper and easier to fit/...
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1 answer
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Compromising on placement or routing of decoupling cap with BGA package

As far I know there are two important points related to power-supply decoupling capacitors. First the placement be less than 3 cm from the digital IC. Second the power tracks route pass through this ...
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7 votes
2 answers
3k views

How can I fix a dry solder pin in a BGA package?

I am facing problem in a 16-bit transceiver chip, 74LVCHR16245AZQLR, which is a 56-pin BGA package. Its one data pin is not working as expected while all other pins are working OK. The problem pin is ...
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6 votes
1 answer
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Is this 0.5mm pitch BGA fanout OK?

I have not used any BGA packages before, but (lucky for me) my first one is a 0.5mm pitch device. Since the pitch is so fine, there is no room for vias between the pads, even at the smallest drill ...
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Eagle - 6 Layer Via pairing error + bga fanout

I'm trying to manually fanout 5 bga's on my 6 layer board. Tried using Eagle's default Auto BGA router and kept coming up with problems regarding my additional layers being used but not enabled, I ...
1 vote
1 answer
259 views

Trouble with Eagle's BGA autorouter

Personally I'm having trouble with eagle's bgaAutoRouter when I use it, it's not doing the bga tracks and routes and I'm wasting a lot of time looking for how to make it work. my settings in image. ...
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AM437x ZDN (N491 BGA) Footprint Dimensions

I have downloaded and studied the layout that TI provides for the TMDSEVM437X AM437x Evaluation Module. After calculating some distances, I concluded that the pad size used for the ZDN footprint is 0....
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1 answer
646 views

Vias in between BGA Pads

I'm designing a 4-layer board with BGA components. The BGA part I'm working with, the SensL MicroFJ-60035 TSV, is a BGA SiPM with its pads in a 6mm by 6mm square layout. Most of the pads are no-...
4 votes
2 answers
225 views

Importance of wicking during rework?

I’m wondering how crucial it is to remove as much of the old solder on a bga chip and corresponding PCB pads. Is it best practice to always wick before applying fresh leaded solder? (Presuming most ...
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1 answer
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Are BGA components sold already with soldering balls on?

I never bought a BGA component and I'm wondering if they arrived already with the soldering ball on it, so the component is ready for the placement and the heating. Maybe it'a a choice of the ...
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1 vote
2 answers
992 views

How to secure an EMMC

My department of the company I am working at is in charge of developing a circuit for production, and security in the embedded system is a crucial requirement. The current prototype of our embedded ...
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3 votes
1 answer
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How close can BGA packages be placed to each other? [closed]

I'm wondering if there is some rule of thumb about how close different BGA packages can be placed to each other. What limits that besides pick and place accuracy? I'll ask a few board assembly ...
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3 votes
2 answers
7k views

How to desolder a BGA 153 eMMC chip

For data recovery I need to desolder a BGA 153 eMMC chip from a dead phone. I'd like to maximize my chances of NOT destroying the eMMC chip in the process (the other remains of the phone do not matter ...
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3 votes
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How to properly define BGA footprint in Eagle?

This question is somewhat relevant to this one. However I am sure it well deserves to be separate. I created a custom device/symbol/footprint for an ARM MCU. However I am doubtful whether I created a ...
0 votes
1 answer
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How can I align chips on PCB?

I am searching for a method/device for aligning chips with pins/pads underneath, like QFN, LGA, BGA and others. I've been searching the Internet, but I could find anything except expensive (several k€)...
4 votes
1 answer
814 views

Procedure tips for connecting traces between DDR3 SDRAM and FPGA

This is my first layout connecting two BGAs: DDR3 SDRAM and a Zynq SoC. The design has 4 layers and I'm using Kicad. So far I've understood the following: ...
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2 answers
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BGA break out and impedance control

I'm connecting two BGAs (0.8mm pitch) which are DDR3 signals. Vendor recommends 40 and 80 ohm for SE and diff traces. My PCB manufacturer suggests the following specifications for the diff traces: <...
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1 answer
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VIA in a pad VS Breakout VIA

I understand the difference between a VIA in a pad and Breakout VIA but why not just use VIA in a pad since it saves space?
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1 vote
1 answer
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BGA prototyping practices

I'm working with a few BGA chips of a very fine pitch 0.5mm even smaller sometimes. What is the practices for being able to essentially breakout all the connections from these chips? I've just been ...
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10 votes
3 answers
825 views

Why does the underside of this flip-chip BGA have small notches in it?

I am reverse engineering an embedded system which has an ARM SoC on it. I have no datasheets at all, so I am going fairly deep with the investigation. It is packaged in a lidless flip-chip BGA. The ...
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4 votes
3 answers
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How to interpret BGA package for creating footprint

I want to create a footprint for a BGA-292 package. I might be wrong but there are 2 different views of the package in the datasheet. The first outline shows: In the photo above, the right side ...
7 votes
1 answer
641 views

Missing pads allowed on BGA?

I'd like to use a 0.35mm BGA in a new design. If possible, I'd like to do this without resorting to an expensive manufacturing process with microvias. This is possible for my particular application, ...
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1 vote
1 answer
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Better Techniques/Equipment for BGA Soldering [duplicate]

I've recently been soldering ball-grid-array parts to boards. This is relatively new to me, and there has been a few mishaps with my technique. I was just wondering how does the community perform BGA ...
0 votes
1 answer
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How to edit on BGA/PGA DECAL?

I want to ask you about this please how I can edit Component DECAL already placed on PCB file ? the idea is I found that some chips may be the same but different pin numbers like if BGA has 160 pins I ...
12 votes
4 answers
3k views

What mad solder type is used for BGA?

Having nothing to do in my workshop, I decided to practise my skills a bit. I digged up a scrapped graphics card from the junk box and decided to try to desolder the RAM-chips (BGA) after seeing how "...
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2 answers
2k views

Altium 15 BGA Fanout option is not working fully

I'm trying to fanout and route a 0.5mm pitch BGA component by creating a ROOM and setting a sepcific BGA rules for that particular component. I followed this video below https://www.youtube.com/...
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