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Questions tagged [bga]

Ball Grid Array - A type of chip packaging in which the "pins" or connections to the PCB is a series of small lands or pads which come prepared with small solder balls attached. When place upon the corresponding matching pattern on the PCB and subjected to solder reflow, the balls melt and form electrical and mechanical connections between the land on the package and the pad on the PCB. Characterized by attachment on the flat bottom of the package.

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Is this 0.4mm pitch BGA fanout OK?

I have not used any BGA packages before, but (lucky for me) my first one is a 0.5mm pitch device. Since the pitch is so fine, there is no room for vias between the pads, even at the smallest drill ...
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Eagle - 6 Layer Via pairing error + bga fanout

I'm trying to manually fanout 5 bga's on my 6 layer board. Tried using Eagle's default Auto BGA router and kept coming up with problems regarding my additional layers being used but not enabled, I ...
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97 views

Trouble with Eagle's BGA autorouter

Personally I'm having trouble with eagle's bgaAutoRouter when I use it, it's not doing the bga tracks and routes and I'm wasting a lot of time looking for how to make it work. my settings in image. ...
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32 views

AM437x ZDN (N491 BGA) Footprint Dimensions

I have downloaded and studied the layout that TI provides for the TMDSEVM437X AM437x Evaluation Module. After calculating some distances, I concluded that the pad size used for the ZDN footprint is 0....
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190 views

Vias in between BGA Pads

I'm designing a 4-layer board with BGA components. The BGA part I'm working with, the SensL MicroFJ-60035 TSV, is a BGA SiPM with its pads in a 6mm by 6mm square layout. Most of the pads are no-...
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Importance of wicking during rework?

I’m wondering how crucial it is to remove as much of the old solder on a bga chip and corresponding PCB pads. Is it best practice to always wick before applying fresh leaded solder? (Presuming most ...
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90 views

Are BGA components sold already with soldering balls on?

I never bought a BGA component and I'm wondering if they arrived already with the soldering ball on it, so the component is ready for the placement and the heating. Maybe it'a a choice of the ...
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251 views

How to secure an EMMC

My department of the company I am working at is in charge of developing a circuit for production, and security in the embedded system is a crucial requirement. The current prototype of our embedded ...
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67 views

How close can BGA packages be placed to each other? [closed]

I'm wondering if there is some rule of thumb about how close different BGA packages can be placed to each other. What limits that besides pick and place accuracy? I'll ask a few board assembly ...
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2k views

How to desolder a BGA 153 eMMC chip

For data recovery I need to desolder a BGA 153 eMMC chip from a dead phone. I'd like to maximize my chances of NOT destroying the eMMC chip in the process (the other remains of the phone do not matter ...
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1k views

How to properly define BGA footprint in Eagle?

This question is somewhat relevant to this one. However I am sure it well deserves to be separate. I created a custom device/symbol/footprint for an ARM MCU. However I am doubtful whether I created a ...
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296 views

How can I align chips on PCB?

I am searching for a method/device for aligning chips with pins/pads underneath, like QFN, LGA, BGA and others. I've been searching the Internet, but I could find anything except expensive (several k€)...
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337 views

Procedure tips for connecting traces between DDR3 SDRAM and FPGA

This is my first layout connecting two BGAs: DDR3 SDRAM and a Zynq SoC. The design has 4 layers and I'm using Kicad. So far I've understood the following: ...
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BGA break out and impedance control

I'm connecting two BGAs (0.8mm pitch) which are DDR3 signals. Vendor recommends 40 and 80 ohm for SE and diff traces. My PCB manufacturer suggests the following specifications for the diff traces: <...
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668 views

VIA in a pad VS Breakout VIA

I understand the difference between a VIA in a pad and Breakout VIA but why not just use VIA in a pad since it saves space?
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269 views

BGA prototyping practices

I'm working with a few BGA chips of a very fine pitch 0.5mm even smaller sometimes. What is the practices for being able to essentially breakout all the connections from these chips? I've just been ...
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490 views

Why does the underside of this flip-chip BGA have small notches in it?

I am reverse engineering an embedded system which has an ARM SoC on it. I have no datasheets at all, so I am going fairly deep with the investigation. It is packaged in a lidless flip-chip BGA. The ...
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710 views

How to interpret BGA package for creating footprint

I want to create a footprint for a BGA-292 package. I might be wrong but there are 2 different views of the package in the datasheet. The first outline shows: In the photo above, the right side ...
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234 views

Missing pads allowed on BGA?

I'd like to use a 0.35mm BGA in a new design. If possible, I'd like to do this without resorting to an expensive manufacturing process with microvias. This is possible for my particular application, ...
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199 views

Better Techniques/Equipment for BGA Soldering [duplicate]

I've recently been soldering ball-grid-array parts to boards. This is relatively new to me, and there has been a few mishaps with my technique. I was just wondering how does the community perform BGA ...
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50 views

How to edit on BGA/PGA DECAL?

I want to ask you about this please how I can edit Component DECAL already placed on PCB file ? the idea is I found that some chips may be the same but different pin numbers like if BGA has 160 pins I ...
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3k views

What mad solder type is used for BGA?

Having nothing to do in my workshop, I decided to practise my skills a bit. I digged up a scrapped graphics card from the junk box and decided to try to desolder the RAM-chips (BGA) after seeing how "...
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968 views

Altium 15 BGA Fanout option is not working fully

I'm trying to fanout and route a 0.5mm pitch BGA component by creating a ROOM and setting a sepcific BGA rules for that particular component. I followed this video below https://www.youtube.com/...
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Using Bead Probe in commercial production

Currently I am making a commercial product which will have two boards connected to each other. There will be top board mounted on the bottom board. The top board have surface bead probes (connection ...
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4k views

Hot air rework temperature to avoid solder melt on opposite end

When removing/replacing chips. Is it safer to use little to no air flow but higher temp heat or lower heat with more airflow? My hot air station is a model 852d+ with a max temp setting of 500c and ...
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369 views

Dysfunctional onboard LAN controller chip getting very hot, is it safe? [closed]

I have had an Intel LGA775-based motherboard (DG33FB) for about 8 years now, but for an year or so the LAN port was unreliable, sometimes working and sometimes not. No software solution was working, ...
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942 views

BGA decoupling capacitors placement

I am trying to figure something apparently basic and I hope somebody might give me an advice. The IC I am working with is XC6SLX25. It has 6 different power regions -- Vccint, Vccaux and Vcc for each ...
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160 views

Bga-like pcb instead of castellation

I need to design a modular circuit and I was thinking about making smaller identical pcbs and solder them on a bigger board (also for module reusability, hyerarchical and modular assembly). The first ...
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3k views

Why are there no BGA chips with triangular tessellation of circular pads (a “hexagonal grid”)?

Ball grid arrays are advantageous integrated circuit packages when a high interconnect density and/or low parasitic inductance is paramount. However, they all use a rectangular grid. A triangular ...
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330 views

Routing through no connect pins in Altium?

I have an 0.5mm pitch BGA part I'm trying to route in Altium. The datasheet specifically calls out a number of balls on the part as having "no internal connection" and I've seen at least one ...
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869 views

BGA package, should I add some solder paste?

I've found that BGA balls actually melt. I've read that some say that it's advised to add some paste, some say to add flux and some say just to put the chip in place. At the hobbiest level, without ...
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BGA escape routing, understanding Altera app note

I'm trying to understand Altera's Application Note 114 "Designing with High-Density BGA Packages for Altera Devices". Specifically, I'm puzzled by the examples on page 19. The "through vias" example ...
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157 views

Need an expansive collection of schematic symbols

I'm trying to get into conponent level board repair, and to do so I need to have a good understanding of electronic symbols. I've been trying to find a pdf that would explain all the symbols I see on ...
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BGA Underfill Problem

The problem is that when I heat an underfill chip to reflow it, the solder tends to boil and come out of the sides causing shorts and other problems. Does anyone know how to prevent that and why it ...
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556 views

What is the pad size required for this BGA AW H3 Chip?

I'm trying to figure out the pad size to use for my footprint according to this datasheet.The last page in the datasheet has the package dimensions. I've also posted the relevant information in a ...
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69 views

Configuring a Virtex-5 FPGA over USB?

I am working on a project with a Virtex-5 FPGA, the only method for uploading bitstreams is over JTAG, if I remember correctly; is it possible to do it any other way? I am trying to save space on the ...
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1k views

Is it considered bad practice to put Vias on BGA pads?

I am routing a Spartan 6 BGA, I have seen a lot of people place the via next to the pad, can the Via be placed on the pad if its filled before the BGA is placed?
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546 views

Difference between and meaning of VSS & VDDS

I am working on a small project that involves BGA's. It has a section of VSS and VDDS pins. The device is an AM437x Sitara. My assumption is, VSS is + and VDDS is ground; would I be correct in ...
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157 views

Copper-core PCB with BGA: X-Ray inspection?

When mounting BGAs, X-Ray is necessary for inspection of the ball soldering. But what if I have a BGA on a copper-core PCB? Are there exisiting inspection systems covering this? Or would I have to ...
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485 views

Can I route between the copper pads

I have a PCB layout as shown. My question is can I route the PCB between the copper pads? The purple colour is solder mask. From what I know solder mask is the green stuff on a PCB which covers the ...
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1answer
155 views

FPGA pin assignment for BGA fanout

I'm working on a project that involves multiple (many) BGA packages, namely interface converters such as Ethernet PHYs connected to a central FPGA. I've already worked out a (tentative) layer ...
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1answer
104 views

Analog Devices Gyro: What are these pins for?

I am after some guidance please. I am designing a basic PCB which includes an ADXRS646 gyro. This is the first time I have designed a circuit with a BGA package and I do not understand the purpose of ...
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1answer
378 views

Removing stencil mask from chip for BGA reballing

I am in the process of reballing my ps3 system. This is my very first time so i am watching tutorials online. My question is how do i remove the stencil mask from the chip without moving the balls? ...
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220 views

ESD protection for work with CPU/GPU

I am ready to perform a BGA reballing operation on my ps3's CPU and GPU chips. Should i take into consideration electrostatic discharge or is it not needed? How can i protect from these dangers? Are ...
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2answers
730 views

BGA: capacitor placement and other pads

I'm doing my first BGA layout with a microcontroller. The bypass capacitors must be on the bottom side and I'd like to have the minimum capacitor size 0402. Now I just have the problem, that the ...
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2answers
981 views

(Basic) BGA Multi-layer stack-up/PCB layout question

Getting into BGA's recently if nothing more than necessity as all the 'cool chips' are only today offered that way. Still, I am missing something I feel essential when it comes to the layout/design/...
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1answer
6k views

How to determine BGA land pad diameter for given ball diameter?

I'm working on a project which requires the use of a CSP package. The product's datasheet provides ball pitch in each axis as X:710um Y:580um and ball diameter as 250um but nothing about the preferred ...
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1answer
873 views

Why does this BGA component have a keep-out layer?

I've pulled the Telit GE864-GPS (datasheet) from the Altium vault. The footprint has a keep-out layer, which prevents me from placing tracks to any pad without using vias. As the pitch is 2.5mm the ...
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2answers
368 views

Intel bga 1170 pinout

I have been researching this question: What is the pinout for an intel celeron N2930 soc? But I cannot find it in the datasheet, or on google. Thanks
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1k views

Temperatures for replacing BGA chip?

Newbie here who is going to try his hand at replacing a BGA chip on a laptop motherboard. I have ordered a new chip: NVIDIA G84-950-A2, and want to confirm some temperatures. Based on some reading,...