Questions tagged [bga]
Ball Grid Array - A type of chip packaging in which the "pins" or connections to the PCB is a series of small lands or pads which come prepared with small solder balls attached. When place upon the corresponding matching pattern on the PCB and subjected to solder reflow, the balls melt and form electrical and mechanical connections between the land on the package and the pad on the PCB. Characterized by attachment on the flat bottom of the package.
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X-Ray inspection criteria
We are seeing board problems when testing a new batch of boards at high temperatures (70°C). This is using leaded solder (and OEM leaded BGA balls) and the component is rated to 100°C.
We believe one ...
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LGA Socket won't come off
Recently I bought a BGA Station to desolder and solder CPU Sockets. Unfortunately I experience issues with that.
Problem: The CPU Socket won't come off. If I rise the temperature, the plastic around ...
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Connecting Power pins on BGA packages
For BGA packages, I never see people tying power/GND pins together on BGA package (e.g. tying +1.1V_FPGA pins together as shown). Usually I see one ball to one via like how the GND is layout as shown. ...
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How to layout interposer?
I need to make an interposer to sit on a QFN pads. I think i want to make small BGA-like balls over the QFN pads.
How do I do it and what do I need to know?
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How to identify pin A1 of tiny DSBGA IC (TPS7A21)?
I have a DSBGA IC (TI TPS7A21) that measures only 0.622 x 0.622 mm. Here is the datasheet. The IC is sectioned into four quadrants. So far, so good, but:
How can I identify from the top view, what pin ...
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Flux residue under BGA - How to remove?
Is there any way to properly remove Flux residue under a BGA package?
Isopropanol won't work here.
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Can the BGA package be centered much better if there are vias in pad for the BGA?
Can the BGA package be centered much better if there are vias in pad for the BGA?
If I have vias like this, should I fill them with solder first?
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Building a DIY BGA Rework Machine
simulate this circuit – Schematic created using CircuitLab
I am trying to build a DIY BGA reflow machine. I have a very crude schematic, but the idea is run each of the 6 heating elements in ...
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How do I select a correct BGA underfill?
Several products we manufacture use fine (0.4mm) pitch BGA devices. In order to improve reliability, we are (by hand) applying BGA underfill to these devices. This is a type of adhesive which flows ...
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How to tune in the right DRC rule for BGA footprint - Altium CircuitMaker
According to JLCPCB, they write that their capability for the clearance between SMD pad and track is 0.2mm.
0.2mm is 7.87401575mil.
If we look at a GBA processor with 0.8mm pitch.
Due to the 0.2mm ...
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Does a BGA connector usually have bigger solder paste than the solder mask opening?
I'm designing a breakout (debug) card for the FPGA Evaluation Board VC707. For this I'm using two FMC connectors (MC-HPC-10), for footprint and design of the connector I got help from the website (...
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Ascertaining that a BGA's decoupling capacitance is good enough
BGA parts often have a large number of power pins in the middle of the package. It is of course important to ensure that the power rail has been sufficiently capacitively decoupled. How can one go ...
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STM32G031Y8Y6TR BGA issue
I want to use STM32G031Y8Y6TR WLCSP(1.86x2.14) package, but I have a problem with routing and I'm looking for your advice.
First, I can not use track width less than 0.09mm, also I can not use via ...
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Off-center via-in-pad
I am designing a board for a 0.8 mm pitch large BGA component. I will be using via-in-pad. There are some differential pairs that need to escape the pin field. The smallest my board house can do (...
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Why is there a difference between pad-to-trace and trace-to-trace clearance?
I am looking to have a PCB produced for a personal project of mine. I have to use very thin traces and tight clearances to escape pads on a BGA chip on my board. I was looking at the capabilities of ...
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How old is too old for BGA chips soldering
I need to buy a batch of UFGBA100 STM32 MCUs from a Chinese broker. I'm concerned that in the quote they specified that the chips will have a date code 19+ (4 years old). How can this affect ...
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How to escape 0.5mm ball grid array pins?
I have a small hobby project in which I want to include the Kingston EMMC04G-M657 eMMC chip. This chip comes in BGA packaging with 0.5mm pitch between balls. I want my board to be cheap, so I'm laying ...
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Does the AM625 (425-pin FCCSP) have collapsing or non-collapsing BGA balls?
Does the AM6254ATCGGAALW have collapsing or non-collapsing BGA balls?
I've checked the Technical Documentation section, but couldn't find the answer. I guess I'm looking for the wrong term, or not ...
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Can I make BGA pads slightly larger to fit within fab tolerances?
I have a BGA part (specifically, IS61WV51216EDBLL-10BLI from ISSI) that uses 0.24mm pads. Is it possible to resize these pads to 0.3mm without making it impossible to manufacture? The reason I want to ...
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What glue to use for edge bonds on a laptop NB
I'm trying to reball the northbrige of my HP Pavilion DV4-1212LA because it stopped working from one day to the other. I've checked, and all of the voltages are present. The laptop itself posts the ...
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Reballing / Estimate size of solder balls for BGA-132 NAND chip with 1mm pitch and diameter of pads 0.3mm (Kingston FB64B08UCT1-0D)
For reballing, I need to estimate the size of original solder balls for the Kingston FB64B08UCT1-0D BGA-132 NAND chip coming from a Kingston ssdnow 256GB SSD, model RBU-SC180DS37/256GH.
Another SSD, ...
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Should I glue BGA chips in the corners before soldering them with hot air?
I have often see ball grid array (BGA) chips, mostly those from CPUs or GPUs, being glued around in the corners with some red glue or to the perimeter with a translucent one.
Having to manually solder ...
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BGA X-Ray Good/Bad voids
I've had very little experience with BGA X-Rays but know that a void does not mean it is bad solder. I've got a case where the BGA gets hot and I took a picture to see, 99% of the balls have voids ...
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What determines the choice of maximum material condition (MMC) versus least material condition (LMC) when designing a BGA footprint?
I am evaluating the IPC-compliant footprint wizard in Altium Designer. One of the steps is to determine the pad size relative to the nominal ball diameter:
Related to this topic, an answer provides a ...
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BGA rework - Help needed
I've just started working on a PCB with BGA components (EPC GaN HEMT devices, plus BGA gate drives), and my attempts at assembly, have been quite frustrating.
I'm using a heat plate (set to 150 ...
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BGA Microcontroller Only Works with Finger Pressing
I have a PCBA with a BGA microcontroller on it. I found that two UART pins send/receive garbled output unless I press my finger down on the BGA package itself.
I've seen this on a few boards and I ...
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How does PCB manufacture work for double sided SMT assembly with BGA's?
How does a conventional board house deal with the issue of reflow during PCB component assembly with BGA's on both sides of the board?
Are two different solders used (like regular lead free SAC305 and ...
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Mediatek MT3333AV doesn't start
Recently I started a project with an MT3333AV GPS IC. I desoldered the chip from the L86 GPS module and put it into my project.
After many tries I still can't start the IC. There is no 1.1 V going ...
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Decoupling capacitors for fine-pitch BGA on single-sided board
For a number of reasons I'm designing a 4-layer board with a fine-pitch BGA (400um). For some manufacturability reasons (the board must be mounted behind some other device) the bottom side of the ...
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Moving BGA pads 0.01mm and making them smaller to work with JLCPCB capabilities
JLCPCB has requirements that mean some BGA packages can't be used because of minimum via size and minimum track spacing and sizes of pads to vis etc.
To overcome this I came up with an idea that in ...
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What's the purpose of these copper tracks on the bottom of BGA package?
These are STM32F746NGH6 microcontroller chips in .8 mm pitch BGA package. I noticed that there are copper tracks on the bottom of this chip, some of which lead to the edge of the chip and are left ...
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BGA reballing and reflowing, how to actually repair dead GPU chips?
To my understanding BGA reflowing is a technique which aims to reconnect bad solder joints on a BGA chip, BGA reballing is a technique to desolder and then resolder a BGA chip both aim to do the same ...
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Are there any resources on Column Last Attach Process? [closed]
I am trying to find resources about this process, but the only thing I have been able to find is the full form of the acronym CLAP any help is appreciated.
This process is used vehemently in the ...
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Flux to lower solder ball melting point
Is there any such flux? I find the balls on BGAs very hard on my home made oven.
From what I gather, mixing up solder types in order to lower the melting point is not the best idea, especially when ...
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Can leaded BGA chips be reflow soldered with lead-free process?
We have a board with two BGA chips. Due to the current shortage of many parts, one of the chips is next-to-impossible to find; except that we found a supplier with a good stock of the non-RoHS / ...
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BGA Stuff, unstuff PCB Pad Short
I am using Artix 7 FPGA (XC7A200T-2FPG676) BGA package on PCB, after unstuffing of FPGA I want to short two pad P18 and R18 on PCB with each other and then wants to stuff back my FPGA .
Note: P18 and ...
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How do I remove this ring around the via?
I am wondering what this is this ring around the via and how do I remove it?
I am using Altium 20.
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What are my options for packaging a WLCSP IC as a DIP?
Hypothetically, let's say I have a chip in a super small WLCSP or BGA package that I want to have packaged as a plastic or ceramic DIP. No extra components; just the pads brought out to pins.
Are ...
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Connect 2 BGA pins before soldering IC?
My first thought was it's not possible but I need a method that could potentially work, just for testing purposes. What I'm trying to do is the following:
I forgot to breakout one BGA pin that I need ...
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Flux for removing LGA socket
I have been looking into the stackexchange searchbar and also I have been searching for a day or two globally, even the "similiar dialog on this website" when I was creating this post.
I ...
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Via on pad for bga decoupling. Is this ok when hand soldering?
I have understood that via on pad is bad for automatic assembly processes, but can be fine for hand soldering, since it is easy to compensate for the solder that wicks into the via.
I am doing a small ...
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When should bare die be used instead of QFN/BGA packages?
I have no experience with bare die as a package, and I have been recently tasked with deciding between bare die, BGA, or QFN package for a SoC.
Searching the internet, I have not really found much ...
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Pros and Cons of QFN and BGA packages
As a PCB designer, is there a known list of advantages and disadvantages to using BGA vs. QFN packages?
Here is the list I have discovered (please correct me if they are incorrect):
BGA
Pros:
Smaller ...
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Mounting BGA package on PCB with force without reflow
I was searching for a method to use a BGA based MCU on PCB which could be easier to change frequently. There are sockets for this purpose but I want to ask what if I simply put MCU on the right place ...
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Is it possible to hand-solder a BGA without solder balls
In an attempt to fix a short circuit on a BGA package, I ended up making things worse. The BGA is desoldered with some of the balls left on the BGA, some on the PCB, and some gone entirely. I don't ...
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BGA VCC and VSS shorted after desoldering
I am really confused with working with BGA chips.
I am new to this but have been following other guides so I thought I should give it a try. I am using a DIY pre heater that has a 800watt IR bottom ...
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Hole size of BGA stencil
I need to design a stencil for reballing.
0.76 is the diameter of the ball.
What should be the size of each hole in the stencil?
I was thinking about 0.8mm. Is that correct?
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Thermal reliefs for via-in-pad under BGA?
I'm doing the layout of a high-speed (Multi gigabit) system based on an FPGA with more than a thousand BGA pads and 0.8mm pitch on a 10-layer board. I'm using via in pads that will be copper-filled ...
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Trace width for breaking out 100Ω differential microstrip from 0.5mm pitch BGA
See bottom of post for the actual questions
First, some context:
I'm making a DisplayPort switch as a hobby project
DisplayPort's high speed lines require 100Ω ± 10% differential impedance, which I'...
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Can I get underneath a BGA mounted chip?
I want to get to some pin signals on a mounted MCU, but it's a ball mounted / soldered one ...
Is there way to 'hack' underneath it to get some signals out? Any usual home-lab setup people came up ...
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