Questions tagged [bga]

Ball Grid Array - A type of chip packaging in which the "pins" or connections to the PCB is a series of small lands or pads which come prepared with small solder balls attached. When place upon the corresponding matching pattern on the PCB and subjected to solder reflow, the balls melt and form electrical and mechanical connections between the land on the package and the pad on the PCB. Characterized by attachment on the flat bottom of the package.

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1answer
71 views

When should bare die be used instead of QFN/BGA packages?

I have no experience with bare die as a package, and I have been recently tasked with deciding between bare die, BGA, or QFN package for a SoC. Searching the internet, I have not really found much ...
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1answer
118 views

Pros and Cons of QFN and BGA packages

As a PCB designer, is there a known list of advantages and disadvantages to using BGA vs. QFN packages? Here is the list I have discovered (please correct me if they are incorrect): BGA Pros: Smaller ...
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3answers
707 views

Mounting BGA package on PCB with force without reflow

I was searching for a method to use a BGA based MCU on PCB which could be easier to change frequently. There are sockets for this purpose but I want to ask what if I simply put MCU on the right place ...
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34 views

Replacing a hard to get BGA part with a small circuit board?

We have a production design PCB with suddenly hard to source BGA part. It could be replaced with a much easier to source device, but we'd prefer not to go back to layout and redo/reverify the board ...
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2answers
343 views

Is it possible to hand-solder a BGA without solder balls

In an attempt to fix a short circuit on a BGA package, I ended up making things worse. The BGA is desoldered with some of the balls left on the BGA, some on the PCB, and some gone entirely. I don't ...
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1answer
104 views

BGA VCC and VSS shorted after desoldering

I am really confused with working with BGA chips. I am new to this but have been following other guides so I thought I should give it a try. I am using a DIY pre heater that has a 800watt IR bottom ...
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1answer
68 views

Hole size of BGA stencil

I need to design a stencil for reballing. 0.76 is the diameter of the ball. What should be the size of each hole in the stencil? I was thinking about 0.8mm. Is that correct?
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76 views

Thermal reliefs for via-in-pad under BGA?

I'm doing the layout of a high-speed (Multi gigabit) system based on an FPGA with more than a thousand BGA pads and 0.8mm pitch on a 10-layer board. I'm using via in pads that will be copper-filled ...
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1answer
38 views

Trace width for breaking out 100Ω differential microstrip from 0.5mm pitch BGA

See bottom of post for the actual questions First, some context: I'm making a DisplayPort switch as a hobby project DisplayPort's high speed lines require 100Ω ± 10% differential impedance, which I'...
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1answer
67 views

Can I get underneath a BGA mounted chip?

I want to get to some pin signals on a mounted MCU, but it's a ball mounted / soldered one ... Is there way to 'hack' underneath it to get some signals out? Any usual home-lab setup people came up ...
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2answers
148 views

Why is eMMC in a BGA package, despite only using a small number of pins?

eMMC comes in BGA packages with many pins (100-200), yet it only uses a few of them (10-30). Why doesn't it come in a package with fewer pins instead, as wouldn't this be cheaper and easier to fit/...
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1answer
60 views

Compromising on placement or routing of decoupling cap with BGA package

As far I know there are two important points related to power-supply decoupling capacitors. First the placement be less than 3 cm from the digital IC. Second the power tracks route pass through this ...
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2k views

How can I fix a dry solder pin in a BGA package?

I am facing problem in a 16-bit transceiver chip, 74LVCHR16245AZQLR, which is a 56-pin BGA package. Its one data pin is not working as expected while all other pins are working OK. The problem pin is ...
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1answer
706 views

Is this 0.5mm pitch BGA fanout OK?

I have not used any BGA packages before, but (lucky for me) my first one is a 0.5mm pitch device. Since the pitch is so fine, there is no room for vias between the pads, even at the smallest drill ...
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163 views

Eagle - 6 Layer Via pairing error + bga fanout

I'm trying to manually fanout 5 bga's on my 6 layer board. Tried using Eagle's default Auto BGA router and kept coming up with problems regarding my additional layers being used but not enabled, I ...
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1answer
181 views

Trouble with Eagle's BGA autorouter

Personally I'm having trouble with eagle's bgaAutoRouter when I use it, it's not doing the bga tracks and routes and I'm wasting a lot of time looking for how to make it work. my settings in image. ...
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1answer
55 views

AM437x ZDN (N491 BGA) Footprint Dimensions

I have downloaded and studied the layout that TI provides for the TMDSEVM437X AM437x Evaluation Module. After calculating some distances, I concluded that the pad size used for the ZDN footprint is 0....
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1answer
395 views

Vias in between BGA Pads

I'm designing a 4-layer board with BGA components. The BGA part I'm working with, the SensL MicroFJ-60035 TSV, is a BGA SiPM with its pads in a 6mm by 6mm square layout. Most of the pads are no-...
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2answers
149 views

Importance of wicking during rework?

I’m wondering how crucial it is to remove as much of the old solder on a bga chip and corresponding PCB pads. Is it best practice to always wick before applying fresh leaded solder? (Presuming most ...
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1answer
154 views

Are BGA components sold already with soldering balls on?

I never bought a BGA component and I'm wondering if they arrived already with the soldering ball on it, so the component is ready for the placement and the heating. Maybe it'a a choice of the ...
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2answers
636 views

How to secure an EMMC

My department of the company I am working at is in charge of developing a circuit for production, and security in the embedded system is a crucial requirement. The current prototype of our embedded ...
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1answer
86 views

How close can BGA packages be placed to each other? [closed]

I'm wondering if there is some rule of thumb about how close different BGA packages can be placed to each other. What limits that besides pick and place accuracy? I'll ask a few board assembly ...
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2answers
5k views

How to desolder a BGA 153 eMMC chip

For data recovery I need to desolder a BGA 153 eMMC chip from a dead phone. I'd like to maximize my chances of NOT destroying the eMMC chip in the process (the other remains of the phone do not matter ...
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2answers
2k views

How to properly define BGA footprint in Eagle?

This question is somewhat relevant to this one. However I am sure it well deserves to be separate. I created a custom device/symbol/footprint for an ARM MCU. However I am doubtful whether I created a ...
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1answer
492 views

How can I align chips on PCB?

I am searching for a method/device for aligning chips with pins/pads underneath, like QFN, LGA, BGA and others. I've been searching the Internet, but I could find anything except expensive (several k€)...
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1answer
636 views

Procedure tips for connecting traces between DDR3 SDRAM and FPGA

This is my first layout connecting two BGAs: DDR3 SDRAM and a Zynq SoC. The design has 4 layers and I'm using Kicad. So far I've understood the following: ...
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2answers
213 views

BGA break out and impedance control

I'm connecting two BGAs (0.8mm pitch) which are DDR3 signals. Vendor recommends 40 and 80 ohm for SE and diff traces. My PCB manufacturer suggests the following specifications for the diff traces: <...
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1answer
1k views

VIA in a pad VS Breakout VIA

I understand the difference between a VIA in a pad and Breakout VIA but why not just use VIA in a pad since it saves space?
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1answer
504 views

BGA prototyping practices

I'm working with a few BGA chips of a very fine pitch 0.5mm even smaller sometimes. What is the practices for being able to essentially breakout all the connections from these chips? I've just been ...
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3answers
685 views

Why does the underside of this flip-chip BGA have small notches in it?

I am reverse engineering an embedded system which has an ARM SoC on it. I have no datasheets at all, so I am going fairly deep with the investigation. It is packaged in a lidless flip-chip BGA. The ...
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3answers
1k views

How to interpret BGA package for creating footprint

I want to create a footprint for a BGA-292 package. I might be wrong but there are 2 different views of the package in the datasheet. The first outline shows: In the photo above, the right side ...
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1answer
405 views

Missing pads allowed on BGA?

I'd like to use a 0.35mm BGA in a new design. If possible, I'd like to do this without resorting to an expensive manufacturing process with microvias. This is possible for my particular application, ...
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1answer
239 views

Better Techniques/Equipment for BGA Soldering [duplicate]

I've recently been soldering ball-grid-array parts to boards. This is relatively new to me, and there has been a few mishaps with my technique. I was just wondering how does the community perform BGA ...
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1answer
63 views

How to edit on BGA/PGA DECAL?

I want to ask you about this please how I can edit Component DECAL already placed on PCB file ? the idea is I found that some chips may be the same but different pin numbers like if BGA has 160 pins I ...
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4answers
3k views

What mad solder type is used for BGA?

Having nothing to do in my workshop, I decided to practise my skills a bit. I digged up a scrapped graphics card from the junk box and decided to try to desolder the RAM-chips (BGA) after seeing how "...
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2answers
1k views

Altium 15 BGA Fanout option is not working fully

I'm trying to fanout and route a 0.5mm pitch BGA component by creating a ROOM and setting a sepcific BGA rules for that particular component. I followed this video below https://www.youtube.com/...
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2answers
10k views

Hot air rework temperature to avoid solder melt on opposite end

When removing/replacing chips. Is it safer to use little to no air flow but higher temp heat or lower heat with more airflow? My hot air station is a model 852d+ with a max temp setting of 500c and ...
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1answer
587 views

Dysfunctional onboard LAN controller chip getting very hot, is it safe? [closed]

I have had an Intel LGA775-based motherboard (DG33FB) for about 8 years now, but for an year or so the LAN port was unreliable, sometimes working and sometimes not. No software solution was working, ...
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1answer
2k views

BGA decoupling capacitors placement

I am trying to figure something apparently basic and I hope somebody might give me an advice. The IC I am working with is XC6SLX25. It has 6 different power regions -- Vccint, Vccaux and Vcc for each ...
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4answers
3k views

Why are there no BGA chips with triangular tessellation of circular pads (a “hexagonal grid”)?

Ball grid arrays are advantageous integrated circuit packages when a high interconnect density and/or low parasitic inductance is paramount. However, they all use a rectangular grid. A triangular ...
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0answers
472 views

Routing through no connect pins in Altium?

I have an 0.5mm pitch BGA part I'm trying to route in Altium. The datasheet specifically calls out a number of balls on the part as having "no internal connection" and I've seen at least one ...
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1answer
1k views

BGA package, should I add some solder paste?

I've found that BGA balls actually melt. I've read that some say that it's advised to add some paste, some say to add flux and some say just to put the chip in place. At the hobbiest level, without ...
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0answers
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BGA escape routing, understanding Altera app note

I'm trying to understand Altera's Application Note 114 "Designing with High-Density BGA Packages for Altera Devices". Specifically, I'm puzzled by the examples on page 19. The "through vias" example ...
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2answers
214 views

Need an expansive collection of schematic symbols

I'm trying to get into conponent level board repair, and to do so I need to have a good understanding of electronic symbols. I've been trying to find a pdf that would explain all the symbols I see on ...
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165 views

BGA Underfill Problem

The problem is that when I heat an underfill chip to reflow it, the solder tends to boil and come out of the sides causing shorts and other problems. Does anyone know how to prevent that and why it ...
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1answer
943 views

What is the pad size required for this BGA AW H3 Chip?

I'm trying to figure out the pad size to use for my footprint according to this datasheet.The last page in the datasheet has the package dimensions. I've also posted the relevant information in a ...
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1answer
77 views

Configuring a Virtex-5 FPGA over USB?

I am working on a project with a Virtex-5 FPGA, the only method for uploading bitstreams is over JTAG, if I remember correctly; is it possible to do it any other way? I am trying to save space on the ...
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1answer
2k views

Is it considered bad practice to put Vias on BGA pads?

I am routing a Spartan 6 BGA, I have seen a lot of people place the via next to the pad, can the Via be placed on the pad if its filled before the BGA is placed?
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1answer
788 views

Difference between and meaning of VSS & VDDS

I am working on a small project that involves BGA's. It has a section of VSS and VDDS pins. The device is an AM437x Sitara. My assumption is, VSS is + and VDDS is ground; would I be correct in ...
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1answer
196 views

Copper-core PCB with BGA: X-Ray inspection?

When mounting BGAs, X-Ray is necessary for inspection of the ball soldering. But what if I have a BGA on a copper-core PCB? Are there exisiting inspection systems covering this? Or would I have to ...