Questions tagged [packages]

In electronics packages refer to the physical encapsulation of a device. Most package names are standardized, so for example a TO-92 package will have similar dimensions and pin spacing between manufacturers so the same PCB footprint may be used. Be aware however many packages have subtle variations, for example TO-206AA, TO-206AB and TO-206AC.

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40 views

How to route and solder TO-263AB packages?

Am working on making a PCB and i was using RFP30N06LE MOSFET on my breadboard circuit, now that am making a PCB i want to use the other variation RF1S30N06LESM of the same component. which as you can ...
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2answers
76 views

Are all the DIP-16 packages the same for PCB library design?

I am designing PCB library for a component whose Package is DIP-16. I have already footprint of this Package in other components. Can I use them interchangeably in the new component in terms of their ...
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1answer
170 views

How to name SMD packages in my Pick&Place library

I have massive problem with finding a correct scheme to name the packages correctly in my Pick&Place machine's library. For example: QFN-16 I have one QFN-16 with 6+6+2+2 leads and another QFN-16 ...
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2answers
68 views

Is there any research for chemical/structural method to prevent observing beneath chip packaging? [closed]

I want to prevent others from reverse-engineering the on-die ROM, using X-ray, microscope, etc.. I think it's best to inject some substance between chip and packag and when the chip package is ...
2
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1answer
39 views

Unknown “2X” and “3X” markings on package outline

I was checking the dimensions of a TO-263 transistor on its datasheet (page 8), when I saw something I could not understand. What do markings "2X" (over dimensions e and b) and "3X" (over dimension b2)...
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3answers
554 views

Identifying pin 1 of Analog Devices REF195

I have the Analog Devices REF195GSZ, and it doesn't have a circle on either the top or bottom by a pin to indicate pin 1. Looks like this: Which is pin 1? The datasheet didn't seem to help either: ...
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1answer
39 views

xmega-E5: exposed pad

I'm drawing my own CAD library for the ATXMEGA*-E5 devices. At page 69 (Seztion 35.2 32Z) there is the drawing of the package 32Z (5x5mm 32-lead VQFN). I cannot find any information about the ...
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2answers
72 views

SOIC8 marking (direction)

I received some ICs in the package SOIC8. Usually the packages have some indicator where the 1 Pin is. This does not. I found the chip soldered on a board on the internet and with the marking on it I ...
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1answer
49 views

Analog Devices `SOIC_N` and `MSOP_N` Recommended Footprints

I do not know if this is on topic, but which are the recommended footprints dimensions (or a reference document) for the SOIC_N and ...
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2answers
346 views

Very high temperature (>500C) IC packages

I was looking for IC packages where I can mount a small wafer (3mmx3mm) wire bond to the leads of the package and conduct operation at 500C. I have contacted couple of companies which do ceramic IC ...
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2answers
125 views

Have SO(P)X components 2.54mm, 1.27mm or smaller pin spacings?

I'm a bit confused about the pin spacings of SO8/SOP8. Example: in Detail 2.54 SOP8, pin spacing is 2.54mm. However, according to Small_Outline_Integrated_Circuit, fragment: Small-outline package ...
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Where can I find IC packages list wich used in BSDL files?

I try to read a BSDL file. For example I take this. Then I change EQFP144 to TFBGA296 in this place: ...
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1answer
148 views

What kind of diode package/case is “case-17”?

The Russian company asked me to purchase several elements for the production of the device. Among the elements in the BOM there were two "5 watts" zener diodes 1N5342B at 6.8 Volts 1N5349B at 12 ...
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36 views

How to update a packaging made in an original design to the one previously used in another design Proteus

I'm working in a design in Proteus where I'm making a multi-board design. I've made a previous design where I've made a PCB model of an ESP8266-ESP01 but initially I was mistaken with the pin ...
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1answer
69 views

do is anyway to detect Tablets Pills package is empty or not? [closed]

do infrared sensor can pass through transparent plastic and work?
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2answers
954 views

Why are MEMS in QFN packages?

I've seen that many (if not all of them) MEMS, like accelerometers, they are only available in QFN packages. Why is that?
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1answer
47 views

Minimum distances between box case connectors and PCB surface conductors

I am working on a few kV PCB design with external voltage connectors (HIGH and GND levels). So user interface connectors are thought to be bananas jacks (they support until 7kV but has soldering ...
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2answers
462 views

What is the significance of numbers (2,3) mentioned in SOT23?

Small outline transistor (SOT) packages have certain numbers which tell the package size, for example, SOT23 or SOT323. But what is the meaning of suffix 23 or 323?
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1answer
64 views

Resources for finding thermal impedances for common IC packages

I'm just looking for some extra resources for thermal impedances of JEDEC standardized packages. I've already found one such article posted by JRC, https://www.njr.com/semicon/package/thermal.html , ...
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1answer
105 views

SMD transistor die vs DIP transistor die [closed]

Is the die of SMD transistors different from die of DIP transistors with a unique part number? Is the power transmission of a transistor dependent on its package type or chip type ?
22
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2answers
4k views

Why do radiation hardened IC packages often have long leads?

What purpose do long leads serve?
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3answers
97 views

Epoxy Resin Molded vs Hermetically Sealed Metal Can Packaging for LEDs and Photodiodes

Between epoxy resin molded vs hermetically sealed metal can packaging for photodiodes and LEDs are there any relevant functional differences I should be aware of when selecting between otherwise ...
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1answer
430 views

Difference between ESOP-8 and SOP-8?

I am ordering some parts for the first PCB projects I've designed in EasyEDA. One of the PMICs I am utilizing is the TP4056 which is listed as being in a "SOP-8_EP_150mil" package. Doing a broader ...
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1answer
75 views

Identify this packaging

I've seen this packaging used by many companies, specifically in mobile equipment, automotive ECU's, marine, and other harsh environment applications. I doubt all these manufactures are making the ...
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1answer
52 views

LED Package/Case

I could'not find the packaging searching online. Can you tell me the package/case types of the LED (right) and PD (left) below? Thanks in advance.
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2answers
683 views

‘One for all’ standardized land pattern v.s. specified land pattern in datasheet

I’ve designed lot of ‘simple’ PCBs for hobby and proof-of-concept purposes, but never for (mass)manufacturing. In order to do so in the future, and further expanding my design skills and knowledge, I’...
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3answers
144 views

Does Crystal/Oscillators package matter?

I design a lot of PCBs that uses microcontrollers with external clocks. For some reason a lot of the example designs always tend to use the big generic HC-49 package. Even factory made modules that I ...
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2answers
309 views

Why does this crystal oscillator have a window?

I came across this device just now, and I can't think of any reason for it to have the window that it has. This isn't just a cutaway display image, either; the datasheet specifically mentions that ...
3
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1answer
148 views

Why do these two resistor networks measure differently?

Why do these two resistor networks measure differently? Aren't two 100k resistors in series supposed to be equivalent to a single 200k resistor? These are being simulated with Circuit Wizard.
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4answers
2k views

Using decapped ICs in production

We were looking for a very specific type of ADC in a small package for one of our projects, and found something suitable in a TSSOP. We wanted to save more space, so looked into getting bare dies; the ...
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1answer
30 views

Diifference between INA827AIDGK & INA827AIDGKR

Whats the difference between the same package of the IC INA827 - INA827AIDGK vs INA827AIDGKR? The datasheet makes no mention of any differences. Except in in.element14.com where INA827AIDGK is ...
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1answer
44 views

replacing obsolete HEMT and differences between Package/Case and Supplier Device Package

I've been designing an amplifier, with ATF33143 as my HEMT in mind. Yet, I just found out the said HEMT went obsolete. So I started looking at SKY65050-372LF as a possible replacement. On the DigiKey ...
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1answer
136 views

Intel max 10 dimensions - datasheet & BSDL mismatch

TL;DR: The BSD file from Intel doesn't match the datasheet. What are the right dimensions? BSD: https://www.intel.com/content/dam/altera-www/global/en_US/others/support/devices/bsdl/10M02SCM153.bsd ...
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2answers
124 views

Name of an enclosure in the shape of a DIP

Years ago, in a junk bin far away, I saw a device which was a small plastic box with protruding pins in the form of a 14-pin DIP — so that you could solder jumpers or small axial components to the ...
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2answers
142 views

What is this cylindrical electronic component with six pins?

I bought a bunch of electronics in a purchase, so I wound up with lots of components I didn't expect. I could identify all of them except these 4. I have 4 little cylinders. Two are stamped "12" and ...
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2answers
144 views

Pin numbering of FPC1020AP chip

I have a single FPC1020AP chip as shown in the picture below. The datasheet for FPC1020 says there are 19 pins, of which 15 are used. However, I cannot find the datasheet for this exact chip, which ...
4
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2answers
137 views

Surface Mount package standards guide?

Is there a universal guide-line for the mechanical dimensions and tolerances of Surface Mount packages across the industry? I'm very new to SMT machine programming (<1 year), so I've been trying ...
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1answer
200 views

Different footprints for different surface mount Resistor packaging?

When using the same surface mount package size (0402) for all my resistors on a board, but using resistors from different manufacturers or with different resistance values, should I create a different ...
4
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1answer
653 views

Altium: What stands for 'N' , 'M' and 'L' as a suffix for SOIC packages

I've noticed while using Altium that SOIC ICs have 3 different SOIC PCB layout to select from, they are named NSOBX_L, NSOBX_N and NSOBX_M (being X de number of pins). The difference I've noticed is ...
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2answers
199 views

SO-8FL Package Footprint Eagle PCB

I am making a PCB with a component that is of the Package SO-8FL. The component is n-channel MOSFET NVMFS4C03N by ON Semiconductor and the datasheet is here. I started to make the package in Eagle, ...
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0answers
95 views

IC package reliability with physical stress

One of the ICs for my design comes in LQFP, TSSOP, QFN and even WLCSP packages. I don't care about the footprint, and the only thing that I want to maximize with the package choice is reliability ...
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2answers
12k views

What is the difference between SOT 23 and SOT 23-3 package types?

I am faced with two types of packaging: SOT 23 SOT 23-3 Is there some difference between them? Based an article in Wikipedia it seems like there are no differences.
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3answers
1k views

What is “folded SMA” package of SMD?

There are three types of package in specification: SMA, Folded SMA and Clip SMA. The link for datasheet: SK32A What is the differences between them ??? I suspect, that Folded SMA it is SMAF, but I ...
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2answers
2k views

How to properly define BGA footprint in Eagle?

This question is somewhat relevant to this one. However I am sure it well deserves to be separate. I created a custom device/symbol/footprint for an ARM MCU. However I am doubtful whether I created a ...
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2answers
441 views

MOSfet thermal design: die-to-package always DRAIN?

All the MOSfet chips seem to have substrate = DRAIN, which means that the heat-dissipation path goes that way. It is assumed that the package DRAIN pin would conduct away most heat from the package to ...
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2answers
65 views

Recommended package size and type for a surface mount linear regulator IC that will be hand-soldered?

I am designing a board that needs a couple linear regulators (5.5v to 3v and 3v to 1.6v) but I am having difficulty selecting a suitable surface mount package type and size that will allow me to hand ...
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1answer
129 views

Can I use different package inductor in impedance matching circuit of NRF52832 design

I am designing a custom PCB with NRF52832 IC. According to datsheet, required specification of inductor L1 are:3.9nH, 0402 package, 5% and a High-frequecy chip inductor. Can I use other package ...
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2answers
56 views

What is this regulators package ?

I'm reverse engineering / hacking a Chinese board which has the footprint for this regulator which i want to replace. I am not quite sure what the package is though, I'm certain someone here does.
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2answers
614 views

QFN20 package sizes

I'm trying to use the capacitative touch chip CPT112S for a project. It comes in QFN20 3x3 package size but the pad layout is different to what I expected and so doesn't fit the DIP adapters I have. I'...
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1answer
66 views

How do I find circuit board layouts (footprints/packages) for embedded processors?

I am seeking layouts for mobile processors like the ones in phones. I am not sure which processor I will use yet but I am just trying to get a general idea of where to find these layouts.