Questions tagged [packages]

In electronics packages refer to the physical encapsulation of a device. Most package names are standardized, so for example a TO-92 package will have similar dimensions and pin spacing between manufacturers so the same PCB footprint may be used. Be aware however many packages have subtle variations, for example TO-206AA, TO-206AB and TO-206AC.

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What are the CRYSTAL package types?

Or, you can point me in the right direction :) I've found HC49 and variants, but no explanation of what the standard is or what the differences are between the different codes [ex. HC49/US, HC49/S, ...
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Is there a CMOS-based device or package/substrate material that can be destructed with excessive electron beam injection or prevent itself?

If there is a such device, we can use it for making the chip difficult to reverse-engineer the circuitary or ROM-style on-die NVRAM/FLASH data through SEM microscope. But is there?
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Can a CPU heatsink be used to cool a TO-3P or a TO-220?

I want to know if my thermal design is appropriate for dissipating 72W of heat while keeping the junction temperature below 150 °C (I am trying to cool an SFH154 that comes in a TO-3P package). My ...
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Has any implementation succeeded to have shared key inside chipset and protect it from exploits?

Since there is a lot of demonstration like using SEM (Scanning Electron Microscope) to read bits from ROM through the scanned image of chipset, is there any implementation that has managed to succeed ...
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Missing row 'I' in package numbering convention: why?

So, I recently discovered a quite painful mistake in my PCB regarding the PGA socket numbering. I have used a row numbered I in my footprint, while the package has ...
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UDFN Package, exposed thermal pad - to ground?

So I've got a design in which I would like to use the AT25SF321B-MHB-T chip by Dialog Semiconductors, but its datasheet does not mention whether the exposed thermal pad should be connected to ground ...
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What's the purpose of these copper tracks on the bottom of BGA package?

These are STM32F746NGH6 microcontroller chips in .8 mm pitch BGA package. I noticed that there are copper tracks on the bottom of this chip, some of which lead to the edge of the chip and are left ...
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5 votes
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Why do some exposed pads have small tabs, and does my PCB footprint need them?

I've noticed a few component packages now that have small "tabs" on the sides of their exposed pad (thermal pad). One example is the Analog Devices ADM7154 LDO: Note the 0.356 x 0.457 mm ...
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Why are some SMD components cylindrical?

Outside of fuses or similar socketed parts, why are there cylindrical SMD components - such as this Zener (package DO-213AA): I feel like this would be a pain in assembly in general, and a nightmare ...
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What are the known ambiguous SMD IC package names?

I just recently discovered (the hard way...) that VSSOP-8 is an ambiguous IC package name. Some manufacturers use this name to describe a 0.65mm pitch device, whereas others use VSSOP-8 to describe a ...
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LM53603 capacitors package size

in my project Im using the LM53603 voltage regulator. In the datasheet's typical application I see 3 capacitors on both the VIN and ...
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SMT PCBA production

I am interested in setting up an SMT factory for producing PCBA. I have researched and know the whole assembly process such as solder paste application, reflow oven, etc. Regarding the packaging of ...
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Why do many old ceramic packages have a gold line?

I noticed a lot (but not all) of ceramic packages seem to have a gold line. What is the function of this line? (I'm not talking about the soldered cap that the die will be placed under, but the gold ...
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Compatibility of package/footprint names

Whenever I look up footprints and packages of components I am confused by the name, for example: SOT-23 and SOT-23-6 The 6 seems to stand for the number of pins. But for: SOT-23 and SOT-23-3 It seems ...
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What can I do about using incorrect P-FET package?

I just got a PCB in I designed from fab, and I quickly discovered I made a mistake in the design. I'm using a P-channel MOSFET, D2PAK, as a high-side switch. Its pinout is (1) gate, (2) drain, (3) ...
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TQFP socket for QFP package

I'm trying to get data off of this IC, and I'm having trouble finding a suitable package. In addition, I need to test ~5 of these on the same PCB, so I need to use a socket. The problem is, I need ...
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Three different dimensions shown in package drawing, what do they mean?

I have an IC that uses this package from analog devices: https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_8_5.pdf. Most of the dimensions are shown in three numbers: I ...
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please identify 5-Pin R1K SOT-23 Package

[![like this ][top mark ][R1K] in the topmark R1K
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How can I get a full guide to choosing the right IC package?

I often find a variety of IC packages options for one chip. I select among them randomly according to the availability, despite my concern about the vibration and shock reliability I googled ...
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How to identify pin 1 from mechanical design

Looking at 10142048 datasheet from TE I'm not sure how to identify pin 1 from top side. At page 9 there are the pin assignments from bottom side only. Now, I guess: ...
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RF Amplifier GND/VCC Connector [duplicate]

Is there a standard connector used to connect the ground/supply pins on an RF amplifier to a power supply? For example, many RF amplifiers (also attenuators) I've seen use two pins like this: But I ...
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Is it a bug in the design of a low side UCC27524A, and 2EDN7424 gate driver if it doesn't use VDD capacitor?

I am using low-side TI and Infineon gate drivers. If I don't use a VDD capacitor, then there is a glitch in the output waveform as shown in the figures. It seems it's the designer's or layout problem ...
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Are IC rail tubes sufficient protection for ESD-safe storage?

I've ended up with a collection of spare IC chips and am wondering what lengths I need to take to store them properly with respect to ESD. Depending on their size they tend to come from the supplier ...
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What are my options for packaging a WLCSP IC as a DIP?

Hypothetically, let's say I have a chip in a super small WLCSP or BGA package that I want to have packaged as a plastic or ceramic DIP. No extra components; just the pads brought out to pins. Are ...
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Pin 1 in OPA237UA in SO package

I have built some circuit and it doesn't work. Can I ask if my interpretation of datasheet is correct? There is no hole, no proper dot on my package, but there is a symbol with 2 concentric circles ...
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To-scale images useful for comparing sizes of small (SOT23 and smaller) packages typical for discrete transistors or diodes?

Is there a to-scale image available somewhere that shows SOT23, SOT323, SOT523, etc. packages used typically for discrete transistors or diodes, so that someone without access to a PCB layout program ...
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Is APDS-9253 pinout really inverted?

I'm drawing the footprint for APDS-9253 and in the datasheet I'm looking at package drawings. As far as I understand, the top-left drawing is a view from component side, the top-right one from solder ...
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Is this a crystal oscillator?

I've never encountered anything in this package. Is it a crystal oscillator? What are the six pins used for? Would it potentially be ovenized? All I know is that the manufacturer is Kyocera. Any help ...
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What is the difference between package description and package option?

I am making an ECG sensor schematic on EAGLE and I am concerned if this is something I should be taking into account while designing?
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resistor package size

I am using EasyEDA to design some PCBs, and I am trying to figure out what package to use for your basic 1/4w resistor. The options are- R-Alial-0.3 R-Alial-0.4 R-Alial-0.5 R-Alial-0.6 R-Alial-0.8 R-...
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Resistors - proper SMD package for newbie

I will be designing an Arduino shield in KiCAD. This will be my first project in KiCAD. Considering I am a newbie in PCB design and I will be performing the soldering, what is the correct package size ...
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How to read data from Agilent 34401a using GPIB-USB-B connection

I want to read data from an Agilent 34401a DMM directly into python or matlab so the data can be automatically recorded. However, I can't seem to make the connection. On my computer the device is ...
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How do you do Electro-mechanical Assembly Documentation?

I realize this isn't specifically EE theory related, but I hope EE documentation advice falls within the scope of this forum! For example, I have an enclosure from a mechanical engineer, and their ...
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SSOP package differences

I want to buy an SMD IC. More specifically, this one: https://www.ti.com/product/SN74CBT3251#order-quality I looked at the page and it offers: SSOP (DB) SSOP (DBQ) TSSOP (PW) I have this IC and i ...
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3 votes
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What is the difference between TO-3 and TO-204AA packaging?

I am trying to build a circuit for a power amplifier and TO-204AA is the packaging used in the circuit diagram. KiCad does not have TO-204AA but it has TO-3. Looking at the image below you will see ...
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Connect crystal to low jitter clock generator

I have this TSX-3225 25MHz crystal. It has two outputs (pin3 and pin1). I want to connect it to the CDCM61001 low jitter clock generator. The CDCM61001 has one crystal input (XIN). Should I connect ...
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Reducing Thermal Pad Size Below Official Footprint - Can It Create Manufacturability Problems?

I'm using a DP83867 Ethernet chip by Texas Instruments in an S-PQFP-G64, 10 x 10 mm package, the mechanical dimension and its recommended footprint are shown at the end of the question. As shown, the ...
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When should bare die be used instead of QFN/BGA packages?

I have no experience with bare die as a package, and I have been recently tasked with deciding between bare die, BGA, or QFN package for a SoC. Searching the internet, I have not really found much ...
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2 votes
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Pros and Cons of QFN and BGA packages

As a PCB designer, is there a known list of advantages and disadvantages to using BGA vs. QFN packages? Here is the list I have discovered (please correct me if they are incorrect): BGA Pros: Smaller ...
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FPGA packaging and performance

I would like begin a new custom FPGA design and I am considering buying a dev kit for experimentation. When the design has finished, I intend to design a dedicated PCB board. If I change the packaging ...
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First pin of TXS0102DCUR

I bought some TXS0102DCUR, and I am not 100% confident that the first pin is from the side of the stripe (left side, relative to the picture). Could anyone confirm, please? I scanned through the ...
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Is there a reason IC in the DIP package seem to have a very high propagation delay and so a very limited admitted frequency?

I scrolled through Mouser and I noticed that when you search for ICs with very low propagation delays there are only IC avaible in packages quite hard to use for an hobbyst/noob like me with very ...
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Dual Inline Package and Chip

I am checking out for dual-inline packages for my chip (which I want to insert in DIP) and I came across some products from Analog Devices, Texas Instruments and NTK Ceramics. However, NTK Ceramics ...
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Why have the same chip in the same package, but with a different number of pins?

STMicroelectronics offers the following two accelerometer chips. The LIS2DW in a 14 pin LGA package The LIS2DW12 in a 12 pin LGA package These two chips are functionally equivalent and have the same ...
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Through-hole LED package identification

I am looking for a way to search for a replacement LED. Unfortunately I don't know the name of the package. The LED has a kind of conical recess at its tip to diffuse the light sideways instead of ...
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How do I attach leads to a SOT-227B/miniBLOC package?

I am reviewing options for full-wave rectifiers for a several thousand watt project, and many of the options are in the SOT-227B/miniBLOC package. I am not familiar with this package, and when I was ...
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Remove/exclude exposed pad of QFN package from PCB layout

I am doing a PCB layout with a Atmel/Microchip MCU ATSAML21E18B-MUT‎ which has QFN-32 package 5x5 mm. This board can have a maximum of 20x40 mm and I am having problems with space because the circuit ...
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What do we Gain by Packing Various Components into SoC

I have been trying to understand that what is the added benefit in shrinking components such as DSP slice, IPU, LCD controller etc into SoC instead of keeping them separate. Is this done only to ...
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Is integrated circuit packaging copyrighted/patented? [closed]

A friend of mine is interested in manufacturing ICs. He wants to know whether the different form types of packages (DIP, LGA, BGA) have intellectual property obstacles to using them. If so, who owns ...
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What does the suffix on the NCV8402ADDR2G mean?

This On Semiconductor part: https://www.onsemi.com/pub/Collateral/NCV8402D-D.PDF is described in the literature as the NCV8402D/AD. It doesn't describe the ...
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