Questions tagged [packages]

In electronics packages refer to the physical encapsulation of a device. Most package names are standardized, so for example a TO-92 package will have similar dimensions and pin spacing between manufacturers so the same PCB footprint may be used. Be aware however many packages have subtle variations, for example TO-206AA, TO-206AB and TO-206AC.

Filter by
Sorted by
Tagged with
0
votes
3answers
33 views

What is the difference between package description and package option?

I am making an ECG sensor schematic on EAGLE and I am concerned if this is something I should be taking into account while designing?
0
votes
1answer
28 views

resistor package size

I am using EasyEDA to design some PCBs, and I am trying to figure out what package to use for your basic 1/4w resistor. The options are- R-Alial-0.3 R-Alial-0.4 R-Alial-0.5 R-Alial-0.6 R-Alial-0.8 R-...
0
votes
5answers
144 views

Resistors - proper SMD package for newbie

I will be designing an Arduino shield in KiCAD. This will be my first project in KiCAD. Considering I am a newbie in PCB design and I will be performing the soldering, what is the correct package size ...
1
vote
0answers
53 views

How to read data from Agilent 34401a using GPIB-USB-B connection

I want to read data from an Agilent 34401a DMM directly into python or matlab so the data can be automatically recorded. However, I can't seem to make the connection. On my computer the device is ...
0
votes
0answers
33 views

How do you do Electro-mechanical Assembly Documentation?

I realize this isn't specifically EE theory related, but I hope EE documentation advice falls within the scope of this forum! For example, I have an enclosure from a mechanical engineer, and their ...
0
votes
1answer
45 views

SSOP package differences

I want to buy an SMD IC. More specifically, this one: https://www.ti.com/product/SN74CBT3251#order-quality I looked at the page and it offers: SSOP (DB) SSOP (DBQ) TSSOP (PW) I have this IC and i ...
3
votes
0answers
53 views

What is the difference between TO-3 and TO-204AA packaging?

I am trying to build a circuit for a power amplifier and TO-204AA is the packaging used in the circuit diagram. KiCad does not have TO-204AA but it has TO-3. Looking at the image below you will see ...
0
votes
1answer
27 views

Connect crystal to low jitter clock generator

I have this TSX-3225 25MHz crystal. It has two outputs (pin3 and pin1). I want to connect it to the CDCM61001 low jitter clock generator. The CDCM61001 has one crystal input (XIN). Should I connect ...
0
votes
0answers
23 views

Reducing Thermal Pad Size Below Official Footprint - Can It Create Manufacturability Problems?

I'm using a DP83867 Ethernet chip by Texas Instruments in an S-PQFP-G64, 10 x 10 mm package, the mechanical dimension and its recommended footprint are shown at the end of the question. As shown, the ...
2
votes
1answer
66 views

When should bare die be used instead of QFN/BGA packages?

I have no experience with bare die as a package, and I have been recently tasked with deciding between bare die, BGA, or QFN package for a SoC. Searching the internet, I have not really found much ...
2
votes
1answer
109 views

Pros and Cons of QFN and BGA packages

As a PCB designer, is there a known list of advantages and disadvantages to using BGA vs. QFN packages? Here is the list I have discovered (please correct me if they are incorrect): BGA Pros: Smaller ...
0
votes
0answers
52 views

FPGA packaging and performance

I would like begin a new custom FPGA design and I am considering buying a dev kit for experimentation. When the design has finished, I intend to design a dedicated PCB board. If I change the packaging ...
1
vote
1answer
36 views

First pin of TXS0102DCUR

I bought some TXS0102DCUR, and I am not 100% confident that the first pin is from the side of the stripe (left side, relative to the picture). Could anyone confirm, please? I scanned through the ...
1
vote
1answer
71 views

Is there a reason IC in the DIP package seem to have a very high propagation delay and so a very limited admitted frequency?

I scrolled through Mouser and I noticed that when you search for ICs with very low propagation delays there are only IC avaible in packages quite hard to use for an hobbyst/noob like me with very ...
1
vote
1answer
78 views

Dual Inline Package and Chip

I am checking out for dual-inline packages for my chip (which I want to insert in DIP) and I came across some products from Analog Devices, Texas Instruments and NTK Ceramics. However, NTK Ceramics ...
0
votes
0answers
33 views

Where to buy part with specific package marking

Hi fellow electronicians, I am looking to buy this Toshiba HDMI-CSI2 bridge chipset and the datasheet states that it comes in two versions: HAL - with HDCP keys HNL - without HDCP keys I have looked ...
1
vote
1answer
154 views

Why have the same chip in the same package, but with a different number of pins?

STMicroelectronics offers the following two accelerometer chips. The LIS2DW in a 14 pin LGA package The LIS2DW12 in a 12 pin LGA package These two chips are functionally equivalent and have the same ...
0
votes
0answers
8 views

What is the parameter WDIS (Package power dissipation) in the attached load switch datasheet?

Can anyone confirm what is exactly meant by WDIS? How is it different from maximum power dissipation based on thermal resistance calculation? http://www.silego.com/uploads/Products/product_499/...
0
votes
1answer
38 views

Through-hole LED package identification

I am looking for a way to search for a replacement LED. Unfortunately I don't know the name of the package. The LED has a kind of conical recess at its tip to diffuse the light sideways instead of ...
1
vote
1answer
51 views

How do I attach leads to a SOT-227B/miniBLOC package?

I am reviewing options for full-wave rectifiers for a several thousand watt project, and many of the options are in the SOT-227B/miniBLOC package. I am not familiar with this package, and when I was ...
0
votes
1answer
90 views

Remove/exclude exposed pad of QFN package from PCB layout

I am doing a PCB layout with a Atmel/Microchip MCU ATSAML21E18B-MUT‎ which has QFN-32 package 5x5mm. This board can have a maximum of 20x40mm and I am having problems with space because the circuit is ...
0
votes
1answer
45 views

What do we Gain by Packing Various Components into SoC

I have been trying to understand that what is the added benefit in shrinking components such as DSP slice, IPU, LCD controller etc into SoC instead of keeping them separate. Is this done only to ...
0
votes
2answers
96 views

Is integrated circuit packaging copyrighted/patented? [closed]

A friend of mine is interested in manufacturing ICs. He wants to know whether the different form types of packages (DIP, LGA, BGA) have intellectual property obstacles to using them. If so, who owns ...
0
votes
1answer
17 views

What does the suffix on the NCV8402ADDR2G mean?

This On Semiconductor part: https://www.onsemi.com/pub/Collateral/NCV8402D-D.PDF is described in the literature as the NCV8402D/AD. It doesn't describe the ...
0
votes
3answers
53 views

How to route and solder TO-263AB packages?

Am working on making a PCB and i was using RFP30N06LE MOSFET on my breadboard circuit, now that am making a PCB i want to use the other variation RF1S30N06LESM of the same component. which as you can ...
0
votes
2answers
93 views

Are all the DIP-16 packages the same for PCB library design?

I am designing PCB library for a component whose Package is DIP-16. I have already footprint of this Package in other components. Can I use them interchangeably in the new component in terms of their ...
4
votes
1answer
181 views

How to name SMD packages in my Pick&Place library

I have massive problem with finding a correct scheme to name the packages correctly in my Pick&Place machine's library. For example: QFN-16 I have one QFN-16 with 6+6+2+2 leads and another QFN-16 ...
0
votes
2answers
74 views

Is there any research for chemical/structural method to prevent observing beneath chip packaging? [closed]

I want to prevent others from reverse-engineering the on-die ROM, using X-ray, microscope, etc.. I think it's best to inject some substance between chip and packag and when the chip package is ...
2
votes
1answer
45 views

Unknown “2X” and “3X” markings on package outline

I was checking the dimensions of a TO-263 transistor on its datasheet (page 8), when I saw something I could not understand. What do markings "2X" (over dimensions e and b) and "3X" (over dimension b2)...
3
votes
3answers
574 views

Identifying pin 1 of Analog Devices REF195

I have the Analog Devices REF195GSZ, and it doesn't have a circle on either the top or bottom by a pin to indicate pin 1. Looks like this: Which is pin 1? The datasheet didn't seem to help either: ...
1
vote
1answer
46 views

xmega-E5: exposed pad

I'm drawing my own CAD library for the ATXMEGA*-E5 devices. At page 69 (Seztion 35.2 32Z) there is the drawing of the package 32Z (5x5mm 32-lead VQFN). I cannot find any information about the ...
0
votes
2answers
183 views

SOIC8 marking (direction)

I received some ICs in the package SOIC8. Usually the packages have some indicator where the 1 Pin is. This does not. I found the chip soldered on a board on the internet and with the marking on it I ...
0
votes
1answer
91 views

Analog Devices `SOIC_N` and `MSOP_N` Recommended Footprints

I do not know if this is on topic, but which are the recommended footprints dimensions (or a reference document) for the SOIC_N and ...
5
votes
3answers
483 views

Very high temperature (>500C) IC packages

I was looking for IC packages where I can mount a small wafer (3mmx3mm) wire bond to the leads of the package and conduct operation at 500C. I have contacted couple of companies which do ceramic IC ...
2
votes
2answers
169 views

Have SO(P)X components 2.54mm, 1.27mm or smaller pin spacings?

I'm a bit confused about the pin spacings of SO8/SOP8. Example: in Detail 2.54 SOP8, pin spacing is 2.54mm. However, according to Small_Outline_Integrated_Circuit, fragment: Small-outline package ...
0
votes
0answers
63 views

Where can I find IC packages list wich used in BSDL files?

I try to read a BSDL file. For example I take this. Then I change EQFP144 to TFBGA296 in this place: ...
0
votes
1answer
257 views

What kind of diode package/case is “case-17”?

The Russian company asked me to purchase several elements for the production of the device. Among the elements in the BOM there were two "5 watts" zener diodes 1N5342B at 6.8 Volts 1N5349B at 12 ...
0
votes
0answers
52 views

How to update a packaging made in an original design to the one previously used in another design Proteus

I'm working in a design in Proteus where I'm making a multi-board design. I've made a previous design where I've made a PCB model of an ESP8266-ESP01 but initially I was mistaken with the pin ...
-4
votes
1answer
75 views

do is anyway to detect Tablets Pills package is empty or not? [closed]

do infrared sensor can pass through transparent plastic and work?
9
votes
2answers
993 views

Why are MEMS in QFN packages?

I've seen that many (if not all of them) MEMS, like accelerometers, they are only available in QFN packages. Why is that?
0
votes
1answer
81 views

Minimum distances between box case connectors and PCB surface conductors

I am working on a few kV PCB design with external voltage connectors (HIGH and GND levels). So user interface connectors are thought to be bananas jacks (they support until 7kV but has soldering ...
5
votes
2answers
2k views

What is the significance of numbers (2,3) mentioned in SOT23?

Small outline transistor (SOT) packages have certain numbers which tell the package size, for example, SOT23 or SOT323. But what is the meaning of suffix 23 or 323?
-2
votes
1answer
64 views

Resources for finding thermal impedances for common IC packages

I'm just looking for some extra resources for thermal impedances of JEDEC standardized packages. I've already found one such article posted by JRC, https://www.njr.com/semicon/package/thermal.html , ...
1
vote
1answer
132 views

SMD transistor die vs DIP transistor die [closed]

Is the die of SMD transistors different from die of DIP transistors with a unique part number? Is the power transmission of a transistor dependent on its package type or chip type ?
23
votes
2answers
4k views

Why do radiation hardened IC packages often have long leads?

What purpose do long leads serve?
0
votes
3answers
164 views

Epoxy Resin Molded vs Hermetically Sealed Metal Can Packaging for LEDs and Photodiodes

Between epoxy resin molded vs hermetically sealed metal can packaging for photodiodes and LEDs are there any relevant functional differences I should be aware of when selecting between otherwise ...
1
vote
1answer
1k views

Difference between ESOP-8 and SOP-8?

I am ordering some parts for the first PCB projects I've designed in EasyEDA. One of the PMICs I am utilizing is the TP4056 which is listed as being in a "SOP-8_EP_150mil" package. Doing a broader ...
2
votes
1answer
78 views

Identify this packaging

I've seen this packaging used by many companies, specifically in mobile equipment, automotive ECU's, marine, and other harsh environment applications. I doubt all these manufactures are making the ...
0
votes
1answer
58 views

LED Package/Case

I could'not find the packaging searching online. Can you tell me the package/case types of the LED (right) and PD (left) below? Thanks in advance.
12
votes
2answers
862 views

‘One for all’ standardized land pattern v.s. specified land pattern in datasheet

I’ve designed lot of ‘simple’ PCBs for hobby and proof-of-concept purposes, but never for (mass)manufacturing. In order to do so in the future, and further expanding my design skills and knowledge, I’...

1
2 3 4 5