It's **possible** you could reflow this tiny BGA onto a gold-plated PCB (flux only, no paste) with a toaster oven approach, but your yield may not be 100% on the first try. It has to be placed within 0.1mm or so (they say +/-0.03mm for production) so a microscope would be a good idea unless your eyes are a lot better than mine. 

There's not a lot of advantage in making a breakout board for such a tiny chip. If you really need to break it out to a breadboard, you can just use a similar chip in a larger package (such as a DIP). Programming has little to do with the package, it will be the same kind of ISP serial programming with a header or pogo pins as you'd do with any other similar chip. Other than size and thermal characteristics the package doesn't affect much. 

The board will look about the same in EDA software on your computer screen as any other board (when you zoom in), the problems will start with getting the board manufactured to the right specifications (the cheap PCB suppliers will probably not be good enough for the fine features) and especially with actually populating the BGA part.