This is the first time I am making a high speed PCB so I am a bit unconfident. 
the ic I am talking about is this 
[https://ftdichip.com/wp-content/uploads/2020/07/DS_FT2232H.pdf][1]

I have followed the schematic in the datasheet above and I have placed the capacitors and inductors close to the ic and I think I have given enough clearance to the traces.

I am planning to use a top layer polygon pour around the ic to make routing easier. Is this a better alternative to using vias?

[![only using JTAG functionality and I have not forgotten oscillator and EEPROM][1]][1]

  [1]: https://i.sstatic.net/7MM0c.png