Standard 0.5mm-pitch LQFP stencil paste openings are pretty thin. From my experience, solder paste is often smeared during stencil removal and manual component placement. Here is my modified land pattern / stencil configuration for solder bridging prevention (usable only for reflow soldering):
[![LQFP 0.5mm][1]][1]
Paste shrink: 0mm
Mask swell: 0.05mm
Distance between pad centers are the same as standard LQFP48/64/100 (see STM32 datasheet).

Idea is to use wider stencil openings and place them farther away (alternate paste openings placement):
[![enter image description here][2]][2]

Stencil and land pattern comparison:
[![enter image description here][3]][3]

[![enter image description here][4]][4]

All drawings/photos in this answer are made by me. Pdf summary: https://www.thundertronics.com/Modified%20LQFP%20land%20pattern%20for%20solder%20bridging%20prevention.pdf

  [1]: https://i.sstatic.net/vYAVG.png
  [2]: https://i.sstatic.net/c3y9f.jpg
  [3]: https://i.sstatic.net/MsCtK.png
  [4]: https://i.sstatic.net/VQaWV.png