Ball Grid Array - A type of chip packaging in which the "pins" or connections to the PCB is a series of small lands or pads which come prepared with small solder balls attached. When place upon the corresponding matching pattern on the PCB and subjected to solder reflow, the balls melt and form electrical and mechanical connections between the land on the package and the pad on the PCB. Characterized by attachment on the flat bottom of the package.

There is no tag wiki for this tag … yet!

Tag wikis help introduce newcomers to the tag. They contain an overview of the topic defined by the tag, along with guidelines on its usage.

All registered users may propose new tag wikis.

(Note that if you have less than 20000 reputation, your tag wiki will be peer reviewed before it is published.)

history | excerpt history