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Think about the reasons why the soldermask (and its related clearance) is used or regulated... Besides the question/comment from @Andy aka , I'd say that for a limit situation like this one, there's no a "tight and rigid need" for having a soldermask clearance around solder pads (really there is, but this is a common trade-off problem!). Having ...


To handle "high currents", you will need numerous (10+ contacts at source and drain and at any metal_to_metal layer changes. There may be special rules about enlarging the wells around the active/source/drain regions. And control signals (to the Gate) may be constrained in how they overlap active regions. These rules will be in the Layout Manual.


There's not, as far as I know, a command line way to do this. You can do it be editing the .kicad_pcb file directly. Steps are: In Pcbnew, draw out an outline anywhere. You'll want to use the Add graphic line tool (shortcut Ctrl-Shift-L) and use the Edge.Cuts layer. Save this file, and close Pcbnew. Open the saved file in your text editor, and search for ...


Well, you don't show how the grounds of the transistor and capacitor C2 return to the reference point of the amplifier. In order for the return currents from each detector not to intercat, you need to return them separately to the reference point, or at least keep them separated until they join to a solid reference point.


at the bottom of kicad you can see X,Y axis so you can calculate the persice dimensions you want. You can use your arrow keys for precision also you can use the line tool draw for example 55mm line copy paste it on more time and do the same thing for 30mm then place the at the start of the X,Y axis.Another efficient way is to import the outline of the board ...


It can be exported to gerber format which is industry standard. To do so you need expressPCB software though. I would request gerber files at the source. ping me a file i'll pdf them for you


Some of the things a designer might think about: EMI: the signal from the Xtal_out pin to the crystal has a strong, high-frequency signal; if there are any other traces near/under the crystal, they could pick up some of this signal, which might directly interfere with their function -- and even if they are digital lines and it doesn't interfere with their ...


The metallic crystal casing might short vias. tRestrict is the only way of preventing tracks from being laid under the crystal, unfortunately it also prevents copper pour, even though it's considered a good practice to lay the copper. In theory it adds capacitance, but that shouldn't have an effect for a mechanical resonator and it doesn't load the resonator ...


The green "shaded" area is the vRestrict area, which restricts the placement of vias in the designated area for design-rule checking (DRC). Why is this an important consideration? Because the metallic (and therefore conducting) crystal can is laid flat and could make contact to exposed PCB traces that are not covered with solder resist. Typically, ...

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