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I would not add ground pours to your inner signal layers. The impedance of the traces on those inner layers is determined by the parameters of the stripline construction – trace width and distance to adjacent planes. Adding ground pours would just mess that up. Isolation between signals on the same layer is better handled by trace separation. Adding ...


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It could be due to limited space for grounding vias. If you had ground pour around your shown layer it would be a very cut-up ground plane. This is okay if you could connect most of it down to your main ground plane. Rule of thumb is the via spacing should be 1/10 of the wavelength of the frequency used on the line. If you cannot connect the dangly-ground ...


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My guess is that a ground pour on the high speed signal layer would reduce the variation in the characteristic impedance of the high speed signals, thus (slightly?) improving signal integrity. Might also reduce the thermal resistance from one side of the board to the other, which can help a tiny bit will thermal management options.


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