Timeline for multi-layer board copper pour
Current License: CC BY-SA 3.0
4 events
| when toggle format | what | by | license | comment | |
|---|---|---|---|---|---|
| Feb 14, 2012 at 16:39 | vote | accept | Ross W | ||
| Feb 7, 2012 at 19:55 | comment | added | Ross W | Thanks for the input. I've decided to just remove the top and bottom pours and stick to the 6-layer design - It's probably cheaper then spending time trying to reroute a couple of power planes on the top and bottom layers | |
| Feb 7, 2012 at 19:54 | vote | accept | Ross W | ||
| Feb 14, 2012 at 16:39 | |||||
| Feb 7, 2012 at 19:35 | history | answered | spearson | CC BY-SA 3.0 |