Timeline for Delamination or missing gold on PCB pads
Current License: CC BY-SA 3.0
7 events
| when toggle format | what | by | license | comment | |
|---|---|---|---|---|---|
| Nov 4, 2016 at 0:46 | comment | added | D.A.S. | I like the ENIG vs HASL or others but it may be harder to control. there are many different ENIG processes. | |
| Nov 4, 2016 at 0:33 | vote | accept | user1080943 | ||
| Nov 4, 2016 at 0:33 | comment | added | user1080943 | I did try scraping it, and neither the grey or the gold material will come off. I am going to contact the manufacturer. | |
| Nov 3, 2016 at 23:00 | answer | added | D.A.S. | timeline score: -1 | |
| Nov 3, 2016 at 21:46 | comment | added | Voltage Spike♦ | Did you try scraping off the grey stuff to see if there is gold underneath? Regardless of what it is, this is an issue that you should take up with the manufacturer because their processes are poor. This could create problems for the assembly processes because the solder might not stick. But we can't tell you because we aren't holding the PCB's in our hand, its your call: be cognizant. | |
| Nov 3, 2016 at 21:34 | review | First posts | |||
| Nov 3, 2016 at 21:46 | |||||
| Nov 3, 2016 at 21:32 | history | asked | user1080943 | CC BY-SA 3.0 |