Timeline for Purpose of pins on side edge of QFN package
Current License: CC BY-SA 3.0
7 events
| when toggle format | what | by | license | comment | |
|---|---|---|---|---|---|
| Nov 18, 2016 at 14:26 | comment | added | user2913869 | silabs.com/Support%20Documents/TechnicalDocs/EFM32ZG108.pdf | |
| Nov 18, 2016 at 9:52 | history | tweeted | twitter.com/StackElectronix/status/799550960016248832 | ||
| Nov 18, 2016 at 3:19 | comment | added | Ale..chenski | I have not seen a QFN package where the side-cut exposed end was not a continuation of the bottom pads. I don't believe this isolation (as shown on the drawings) is technologically possible.Which exactly chip is this? | |
| Nov 17, 2016 at 23:54 | comment | added | D.A.S. | youtube.com/watch?time_continue=225&v=c_Qt5CtUlqY | |
| Nov 17, 2016 at 23:29 | answer | added | The Photon | timeline score: 6 | |
| Nov 17, 2016 at 23:25 | comment | added | Olin Lathrop | QFN packages aren't for soldering with a soldering iron. They are intended for a reflow process, and you can use a hot air station for hand-soldering. | |
| Nov 17, 2016 at 23:20 | history | asked | user2913869 | CC BY-SA 3.0 |