Timeline for How to solder an SMD component with a "pad" on the bottom?
Current License: CC BY-SA 3.0
3 events
| when toggle format | what | by | license | comment | |
|---|---|---|---|---|---|
| Jan 9, 2018 at 12:51 | vote | accept | eeze | ||
| Jan 9, 2018 at 12:52 | |||||
| Jan 7, 2018 at 19:22 | comment | added | user371366 | in your example image this might work, because the pad isn't connected to a large surface area. but for something that will dissipate a lot of heat like motor driver chip, a much larger plane should be used, possibly connected using thermal vias. given the whole point of this is to conduct heat away from the chip, it becomes very difficult to actually heat up the pad unless you have a way of heating up the rest of the board as well | |
| Jan 7, 2018 at 8:16 | history | answered | jpa | CC BY-SA 3.0 |