Timeline for Why aren't CPUs cooled from below as well as above?
Current License: CC BY-SA 3.0
8 events
when toggle format | what | by | license | comment | |
---|---|---|---|---|---|
Jan 17, 2018 at 8:53 | history | edited | Marcus Müller | CC BY-SA 3.0 |
added 18 characters in body
|
Jan 16, 2018 at 21:54 | comment | added | Voltage Spike♦ | I agree that it would be higher than .25, but those vias are not very large and nowadays they run microvias and blind and buried vias so most of that copper does not run all the way through the board. Any copper will wick away heat, but you also need a large thermal pathway which isn't going to happen on the bottom of the CPU, because it is much easier to place it on the top. | |
Jan 16, 2018 at 21:39 | comment | added | Paul Uszak | But the FR4 figure is misleading somewhat. The PCB beneath a modern CPU is highly populated with many solder filled vias and copper tracks. Look at the pin density on my photo. And the ground /power planes. And through board socket and cooler mounts. I would expect the aggregate thermal conductivity of all of that to be much higher than 0.25. Just stick your finger under your motherboard to feel the heat... | |
Jan 16, 2018 at 4:35 | history | edited | Voltage Spike♦ | CC BY-SA 3.0 |
deleted 1 character in body
|
S Jan 16, 2018 at 4:34 | history | suggested | Nat | CC BY-SA 3.0 |
\$\TeX\$ and Wikipedia links.
|
Jan 16, 2018 at 4:22 | review | Suggested edits | |||
S Jan 16, 2018 at 4:34 | |||||
Jan 16, 2018 at 4:09 | history | edited | Voltage Spike♦ | CC BY-SA 3.0 |
added 8 characters in body
|
Jan 15, 2018 at 23:08 | history | answered | Voltage Spike♦ | CC BY-SA 3.0 |