Timeline for Why aren't CPUs cooled from below as well as above?
Current License: CC BY-SA 3.0
9 events
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| Jan 17, 2018 at 21:37 | comment | added | Paul Uszak | Re. last para. If the enclosure allowed it, could you then cool one of your bottom heatsinked chips from above as well, ie. both sides? | |
| Jan 16, 2018 at 18:27 | comment | added | 8bittree | Note that the image is of AMD's Fiji GPU, used in the R9 Fury series. The silicon interposer it uses is a rarity, even among multi-chip packages. Most simply put all the chips on the FR4 substrate, but Fiji's four stacks of High Bandwidth Memory required silicon to provide the necessary wire density for a 1024 bit bus to each stack. | |
| Jan 16, 2018 at 15:52 | comment | added | rackandboneman | Also, you need to put these capacitors somewhere, and it is crucial the connections are short. | |
| S Jan 16, 2018 at 10:25 | history | suggested | Peter Cordes | CC BY-SA 3.0 |
2nd last para: low conductivity = high resistance. Last sentence: "less material". When I first read that sentence, I thought it was saying "less conductivity", because the last clause before that sentence was talking about conductivity.
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| Jan 16, 2018 at 10:23 | review | Suggested edits | |||
| S Jan 16, 2018 at 10:25 | |||||
| Jan 16, 2018 at 10:23 | history | edited | Joren Vaes | CC BY-SA 3.0 |
fixed wording (meant to say poor thermal conductivity)
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| Jan 16, 2018 at 10:22 | comment | added | Joren Vaes | @PeterCordes Correct! Thanks for pointing that out, I'll correct it right away. | |
| Jan 16, 2018 at 10:18 | comment | added | Peter Cordes | I think you got your wording backwards here: "the thermal conductivity from the die to the pins is still high", but it looks like you meant to say conductivity=low or resistance (resistivity?)=high, not high conductivity. | |
| Jan 16, 2018 at 10:09 | history | answered | Joren Vaes | CC BY-SA 3.0 |