Timeline for LT3083 heat dissipation
Current License: CC BY-SA 4.0
12 events
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| Jul 2, 2018 at 18:23 | comment | added | D.A.S. | IT IS VERY TRUE, In order to displace the heat and equalize the voltage drop on each CC chip. I grow weary of your false statements and errors in calculations, and constant false critics. Last Warning! The salad is your inept lack of experience. I am not talking to a rookie right? You worked at IBM making an ethernet port yet myopic in experience. Are you even an EE? | |
| Jul 2, 2018 at 1:59 | comment | added | D.A.S. | I would expect you to understand control system theory but I may have overestimated your background experience | |
| Jul 2, 2018 at 0:31 | history | edited | Misunderstood | CC BY-SA 4.0 |
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| Jul 1, 2018 at 16:12 | comment | added | D.A.S. | of course Resistors can withstand higher temps, but bulbs even higher when warm and also have a quasi CC response at low V. I mastered analog design 40 yrs ago learning from the best | |
| Jul 1, 2018 at 5:07 | comment | added | D.A.S. | No I designed mine with discretes then in '75 did a UART in SSI CMOS before MOT released one. Then in 77 shipped a custom robotic SCADA system with eddy current inspection for Nuclear reactors with remote control, step, automated macros and remote control TV, throat mics all over one coax cable. | |
| Jul 1, 2018 at 3:49 | comment | added | D.A.S. | I was designing LDO's in 1974 . How small of you. I guess you never saw the 5 Ohm resistor in my Falstad simulation before your answer | |
| Jul 1, 2018 at 2:58 | comment | added | D.A.S. | By conflating your ideas with what is presented you misinterpret your thoughts into criticsm rather than what is presented an adjustable CC followed by an adjustable CV with no heat loss R in series. Your insinuations are rude and offensive to my level of experience. when combined with errors in assumptions. I think we both agree the design has shortcomings if you do not realize the thermal heatsink required. But retrofitting a series R for a fixed low V high A is certainly correct. | |
| Jul 1, 2018 at 2:26 | comment | added | D.A.S. | You are not reading me as I intended. I did not confuse emissivity with convection, merely stated with free air condition vs (confined or force air) and 45 Watts could be dissipated with 18V input and output at 3V @3A so 15V*3A =? Why do you cover up your errors? | |
| Jul 1, 2018 at 1:57 | comment | added | Misunderstood | @TonyStewartolderthandirt I fail to see where your comment has any relevance to the topic even if it were correct. The point is there is not 20-30 watts that needs to be dissipated when a series power resistor is used to alleviate the thermal stress from the regulator. FR4 is a good conductor of heat when compared to air. The emissivity of the surface has nothing to do with convection as radiation which is hardly relevant here. Whether the surface is bare copper or solder mask has an insignificant effect on convection. Obviously you did not read the TI App Note Thermal Design By Insight... | |
| Jul 1, 2018 at 1:41 | comment | added | D.A.S. | air heat transfer ~14W / 'Cm² is equal to about 56'C rise per sq.in per Watt (double sided) so 1sqin/W of heat sink area. to permit conductor rise of 56'C for sink exposed to free air, which may be rough, pipes or other shapes to improve surface area density which would apply to the equivalent rough surface area of a heat sink or the planar Alum surface of smooth alum. PCB is only effectively 1 sided as Epoxy is an insulator unless very thin and many thermal vias. so 2 sqin/W for PCB copper is my rule of thumb but depends on max ambient. | |
| Jul 1, 2018 at 0:40 | history | edited | Misunderstood | CC BY-SA 4.0 |
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| Jul 1, 2018 at 0:24 | history | answered | Misunderstood | CC BY-SA 4.0 |