The 3 big enemies of electronic parts are:

1. Unstable power supply, already at the devices specified limits.

2. Static charges or creapage current due to high voltage close to high-impedance inputs.

3. Temperature rise of device by ambient rise or a nearby power device. If shoot-through currents are allowed due to a lack of current limiting then a latent failure with a semi-predictable timeline is inevitable. I have seen small zeners fail and LEDs fail due to large capacitors as a direct power source or power filter. Sometimes an over sized capacitor is NOT a good thing.

Combine with a part that is hotter than expected (heat almost always increases overall current flow, and can create 'weak spots' that allow a shoot-through of higher current) and you have ripe conditions for shoot-through currents which often destroy a device the first time. It does not mean the devices insides have melted into a blob (which is possible) as much as it means there is now a leakage path in the device itself.

If this event repeats the current flow could increase by ten each time, but sooner or later there is a 'last time' when the part no longer functions. It may get very hot and/or read as a short across its power pins.

I did not mention cold because it takes arctic-like conditions for many parts to even drift out of spec. Below 100\$^o\$ F the problem is solder connections cracking due to a shrinking motherboard.

The 3 big enemies of electronic parts are:

1. Unstable or noisy power supply, already at the devices specified limits.

2. Static charges or creapage current due to high voltage close to high-impedance inputs.

3. Temperature rise of device by ambient rise or a nearby power device or lack of a heat-sink (if required). If shoot-through currents are allowed due to a lack of current limiting then a latent failure with a semi-predictable timeline is inevitable. I have seen small zeners fail and LEDs fail due to large capacitors wired directly across them as a ripple filter. Sometimes an over sized capacitor is NOT a good thing.

Combine with a part that is hotter than expected (heat almost always increases overall current flow, and can create 'weak spots' that allow a shoot-through of higher current) and you have ripe conditions for shoot-through currents which often destroy a device the first time. It does not mean the devices insides have melted into a blob (which is possible) as much as it means there is now a leakage path in the device itself.

If this event repeats the current flow could increase by ten each time, but sooner or later there is a 'last time' when the part no longer functions. It may get very hot and/or read as a short across its power pins.

I did not mention cold because it takes arctic-like conditions for many parts to even drift out of spec. Below 100\$^o\$ F the problem is solder connections cracking due to a shrinking motherboard.

The 3 big enemies of electronic parts are:

1. Unstable power supply, already at the devices specified limits.

2. Static charges or creapage current due to high voltage close to high-impedance inputs.

3. Temperature rise of device by ambient rise or a nearby power device. If shoot-through currents are allowed due to a lack of current limiting then a latent failure with a semi-predictable timeline is inevitable. I have seen small zeners fail and LEDs fail due to large capacitors as a direct power source or power filter. Sometimes an over sized capacitor is NOT a good thing.

Combine with a part that is hotter than expected and you have ripe conditions for shoot-through currents which often destroy a device the first time. It does not mean the devices insides have melted into a blob (which is possible) as much as it means there is now a leakage path in the device itself.

If this event repeats the current flow could increase by ten each time, but sooner or later there is a 'last time' when the part no longer functions. It may get very hot and/or read as a short across its power pins.

I did not mention cold because it takes arctic-like conditions for many parts to even drift out of spec. Below 100\$^o\$ F the problem is solder connections cracking due to a shrinking motherboard.

The 3 big enemies of electronic parts are:

1. Unstable power supply, already at the devices specified limits.

2. Static charges or creapage current due to high voltage close to high-impedance inputs.

3. Temperature rise of device by ambient rise or a nearby power device. If shoot-through currents are allowed due to a lack of current limiting then a latent failure with a semi-predictable timeline is inevitable. I have seen small zeners fail and LEDs fail due to large capacitors as a direct power source or power filter. Sometimes an over sized capacitor is NOT a good thing.

Combine with a part that is hotter than expected (heat almost always increases overall current flow, and can create 'weak spots' that allow a shoot-through of higher current) and you have ripe conditions for shoot-through currents which often destroy a device the first time. It does not mean the devices insides have melted into a blob (which is possible) as much as it means there is now a leakage path in the device itself.

If this event repeats the current flow could increase by ten each time, but sooner or later there is a 'last time' when the part no longer functions. It may get very hot and/or read as a short across its power pins.

I did not mention cold because it takes arctic-like conditions for many parts to even drift out of spec. Below 100\$^o\$ F the problem is solder connections cracking due to a shrinking motherboard.