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JRE
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The question here might seem a bit tangent for this Stack Exchange but here it goes.

In the Product Developmentproduct development phase, one of the important factors under consideration is the availability of selected components. If the plan is to sell a particular product for the next 10 years, the components used need to be available throughtoutthroughout this time.

So the questions are:

  1. Is it true that DIP chips and ICs are going to be obsolete in the near near future?
  2. Is it wise to consider the SMD packages for development starting 2020? For egexample, will DIP versions of MCP3004/8 or ULN chips go extinct shortly (in the coming 5 years) and decision should be taken to move to SMD versions of the same?
  3. Moreover, irrespective of the chips, is there a way to predict or get notified as to when the chips will be made obsolete?

The question here might seem a bit tangent for this Stack Exchange but here it goes.

In the Product Development phase, one of the important factors under consideration is the availability of selected components. If the plan is to sell a particular product for the next 10 years, the components used need to be available throughtout this time.

So the questions are:

  1. Is it true that DIP chips and ICs are going to be obsolete in the near future?
  2. Is it wise to consider the SMD packages for development starting 2020? For eg, will DIP versions of MCP3004/8 or ULN chips go extinct shortly (in the coming 5 years) and decision should be taken to move to SMD versions of the same?
  3. Moreover, irrespective of the chips, is there a way to predict or get notified as to when the chips will be made obsolete?

The question here might seem a bit tangent for this Stack Exchange but here it goes.

In the product development phase, one of the important factors under consideration is the availability of selected components. If the plan is to sell a particular product for the next 10 years, the components used need to be available throughout this time.

So the questions are:

  1. Is it true that DIP chips and ICs are going to be obsolete in the near future?
  2. Is it wise to consider the SMD packages for development starting 2020? For example, will DIP versions of MCP3004/8 or ULN chips go extinct shortly (in the coming 5 years) and decision should be taken to move to SMD versions of the same?
  3. Moreover, irrespective of the chips, is there a way to predict or get notified as to when the chips will be made obsolete?
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Is it easy to predict or get notified about obsolescence for DIP ICs?

The question here might seem a bit tangent for this Stack Exchange but here it goes.

In the Product Development phase, one of the important factors under consideration is the availability of selected components. If the plan is to sell a particular product for the next 10 years, the components used need to be available throughtout this time.

So the questions are:

  1. Is it true that DIP chips and ICs are going to be obsolete in the near future?
  2. Is it wise to consider the SMD packages for development starting 2020? For eg, will DIP versions of MCP3004/8 or ULN chips go extinct shortly (in the coming 5 years) and decision should be taken to move to SMD versions of the same?
  3. Moreover, irrespective of the chips, is there a way to predict or get notified as to when the chips will be made obsolete?