Timeline for Remove/exclude exposed pad of QFN package from PCB layout
Current License: CC BY-SA 4.0
8 events
| when toggle format | what | by | license | comment | |
|---|---|---|---|---|---|
| Jan 31, 2022 at 20:37 | history | edited | Null♦ | CC BY-SA 4.0 |
fixed tags
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| Mar 8, 2020 at 18:06 | comment | added | The Photon | Why can't you go multilayer? If it's because of cost, your solution is almost certainly worse than the problem you're trying to solve. | |
| Mar 8, 2020 at 15:16 | comment | added | Marcus Müller | pretty weak argument: if your boards are so cheap that you have to pay for the extra almost certainly manual step of putting an insulator below a QFN device (however you'll guarantee good soldering after), then maybe get better boards made. | |
| Mar 8, 2020 at 15:15 | answer | added | Marcus Müller | timeline score: 4 | |
| Mar 8, 2020 at 15:10 | history | edited | abomin3v3l | CC BY-SA 4.0 |
edited title
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| Mar 8, 2020 at 15:09 | comment | added | abomin3v3l | Yes, I know solder mask is an insulator, but maybe its isolation could not de 100% perfect considering the production of a high quantity of boards and a possible imperfection on the PCB fabrication. That would be just to have a guarantee. | |
| Mar 8, 2020 at 14:59 | comment | added | Marcus Müller | "place an isolating material": you realize that's exactly what solder mask is, right? | |
| Mar 8, 2020 at 14:55 | history | asked | abomin3v3l | CC BY-SA 4.0 |