Timeline for Is there a rule of thumb or an IPC standard for reducing (windowing) solder paste deposition on exposed pads?
Current License: CC BY-SA 4.0
4 events
| when toggle format | what | by | license | comment | |
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| Feb 21, 2023 at 17:38 | history | edited | Kuba hasn't forgotten Monica | CC BY-SA 4.0 |
added 5 characters in body
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| Feb 21, 2023 at 17:33 | vote | accept | JYelton | ||
| Dec 22, 2022 at 1:17 | comment | added | JYelton | I added the pad dimensions for reference (4.8mm^2) but I don't want to limit answers to that specific pad size. Thanks for the info so far. (I worked in professional offset printing for over a decade so am very familiar with halftone! But a stencil wouldn't release solder paste if we were to create fine meshes of dots like that, I presume!) | |
| Dec 21, 2022 at 23:42 | history | answered | Kuba hasn't forgotten Monica | CC BY-SA 4.0 |