Timeline for What is the difference between "via-in-pad" and a via in a pad?
Current License: CC BY-SA 4.0
4 events
| when toggle format | what | by | license | comment | |
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| Nov 29, 2023 at 22:26 | vote | accept | Hearth | ||
| Apr 15, 2023 at 18:39 | history | edited | Nick Alexeev | CC BY-SA 4.0 |
added 45 characters in body
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| Apr 14, 2023 at 22:15 | comment | added | Kuba hasn't forgotten Monica | As a poor-man's alternative I've used pads on both sides of the board - that way the excess solder from the other side of the board would fill in the via and leave enough for the BGA pads to make contact. Definitely not recommended in production, but for prototyping it worked in a pinch. The pad "on the other side" can also be larger, so that it can fit more solder, and balance out the solder load on the BGA side. | |
| Apr 14, 2023 at 22:06 | history | answered | Nick Alexeev | CC BY-SA 4.0 |