Skip to main content
5 events
when toggle format what by license comment
Apr 8 at 23:44 comment added Jonathan S. The board in question is wave soldered, not reflowed. All SMD components are glued down and won't go anywhere no matter what.
Apr 8 at 19:55 comment added Hearth I'm not convinced that having exposed copper does anything for tombstoning. The thermal impedance of the soldermask is pretty insignificant.
Apr 8 at 19:20 comment added Vincent Yes, I was talking about thermal reliefs. It seemed to me that the question was about the particular arrangement of exposed copper on certain traces = increasing thermal dissipation (that's what the OP was suggesting).
Apr 8 at 17:59 comment added Andrew Morton Were you perhaps thinking of thermal reliefs rather than the increased current capacity due to greater conductor cross-section that's relevant to the question?
Apr 8 at 17:45 history answered Vincent CC BY-SA 4.0