Timeline for Solder Pad and Stencil Mask Data Sheet - Confused
Current License: CC BY-SA 4.0
7 events
| when toggle format | what | by | license | comment | |
|---|---|---|---|---|---|
| Aug 21, 2018 at 22:57 | vote | accept | BlueSky | ||
| Aug 21, 2018 at 22:57 | comment | added | BlueSky | Thanks Spehro and Dean. In Eagle I think the solder mask layer is tcream layer 31, right? | |
| Aug 20, 2018 at 4:03 | comment | added | Dean Franks | Too much solder under a large pad can also "float" the part above the plane of the board and prevent wetting of smaller pins (which then end up not connected). | |
| Aug 19, 2018 at 22:46 | history | edited | Spehro 'speff' Pefhany | CC BY-SA 4.0 |
added 42 characters in body
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| Aug 19, 2018 at 22:40 | history | edited | Spehro 'speff' Pefhany | CC BY-SA 4.0 |
added 42 characters in body
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| Aug 19, 2018 at 22:28 | history | edited | Spehro 'speff' Pefhany | CC BY-SA 4.0 |
added 77 characters in body
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| Aug 19, 2018 at 22:12 | history | answered | Spehro 'speff' Pefhany | CC BY-SA 4.0 |