Timeline for Using decapped ICs in production
Current License: CC BY-SA 4.0
2 events
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| Oct 13, 2018 at 22:06 | comment | added | Jack B | I recon if I could get a handful of chips looking like that, I could do a decent job of using one in a prototype. We'd probably go round cutting the wirebonds close to the leadframe, then trim away the leadframe with a slurry saw or similar. If there's space to bond new wires on the wirebond pads, great, if not then we might be able to bend the existing ones down and connect them to a PCB with die attach epoxy. The yield wouldn't be anywhere near good enough for production though. I was really wondering if anyone knew of a process/service which would give good yields. | |
| Oct 13, 2018 at 16:25 | history | answered | Jeroen3 | CC BY-SA 4.0 |