I am designing a double layer board and in my layout I am running into problems. I want to keep the board as small as possible. But I should also be able to assemble it per hand. So all my resistors and ceramic caps are 0805 of size. My problem is that I am running out of space with these dimensions for possible routing on the top layer. Since the bypass cap. needs to have a low impedance path to the component I was thinking of placing these bypass caps directly under an ic to save space. But would that potentially introduce a parasitic element and disrupt the working of the chip? I have no idea. Any share of expertise on the matter would be appriciated.

I am designing a double layer board and in my layout I am running into problems. 

I want to keep the board as small as possible, but I should also be able to assemble it per hand. I made all my resistors and ceramic capacitors of 0805 of size. 

My problem is that I am running out of space with these dimensions for possible routing on the top layer. 

Since the bypass capacitors need to have a low impedance path to the component I was thinking of placing these bypass capacitors directly under an IC to save space. Wouldn't that potentially introduce a parasitic element and disrupt the working of the chip? I have no idea. Any share of expertise on the matter would be appreciated.