Timeline for Ground Pours or Thieving for Filling Unused Space on PCB Signal Layers
Current License: CC BY-SA 4.0
7 events
| when toggle format | what | by | license | comment | |
|---|---|---|---|---|---|
| May 29, 2022 at 18:42 | answer | added | tobalt | timeline score: 1 | |
| May 29, 2022 at 17:14 | vote | accept | Ivan Vlaykov | ||
| May 29, 2022 at 17:14 | answer | added | Ivan Vlaykov | timeline score: 0 | |
| May 27, 2022 at 14:16 | comment | added | Lorenzo Marcantonio | I haven't seen dots or hatches in the last 20 years. Probably on some (cheaper) process they are still effective. Copper balance however can be an issue for board bending | |
| May 27, 2022 at 7:34 | comment | added | Ivan Vlaykov | Isn't that a thing of the past already or are they still people using it? | |
| May 26, 2022 at 12:56 | comment | added | Lorenzo Marcantonio | There's a third way: hatch fills. Like ground pours but with less copper and the copper ridges add some mechanical stability | |
| May 26, 2022 at 12:40 | history | asked | Ivan Vlaykov | CC BY-SA 4.0 |