Often at the end of a PCB design there is unused space on the signal layers. It is important to fill this space because of:
- The electroplating process (valid only for TOP and BOTTOM)
- The even distribution of copper on internal layers ensures the boards are flat at the end
There are two ways people in the industry solve this:
- Ground pours
- Thieving dots
The way I see it is that in 95% of the cases it is better to use thieving, just because it is easier and the chance to create an issue is lower as compared to ground pours. I do understand that ground pour can be a sensible solution as well provided that you make sure that it is really well stitched and that it does not interfere with the impedances of your high speed signals. However, I don't understand what benefits it provides that would make it worth for me to put in the additional effort. Still a lot of people do it, so I was wondering if someone has a nice overview of all the pros and cons of both approaches.