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Standard 0.5mm-pitch LQFP stencil paste openings are pretty thin. From my experience, solder paste is often smeared during stencil removal and manual component placement. Here is modified land pattern / stencil configuration for solder bridging prevention (usable only for reflow soldering): Paste shrink: 0mm Mask swell: 0.05mm Distances between pad centers are the same as standard LQFP48/64/100 (see STM32 datasheet).

Idea is to use wider stencil openings and place them farther away (alternate paste openings placement):

Stencil and land pattern comparison:

All drawings/photos in this answer are made by me. Pdf summary: https://www.thundertronics.com/Modified%20LQFP%20land%20pattern%20for%20solder%20bridging%20prevention.pdf

Standard 0.5mm-pitch LQFP stencil paste openings are pretty thin. From my experience, solder paste is often smeared during stencil removal and manual component placement. Here is modified land pattern / stencil configuration for solder bridging prevention (usable only for reflow soldering): Paste shrink: 0mm Mask swell: 0.05mm Distances between pad centers are the same as standard LQFP48/64/100 (see STM32 datasheet).

Idea is to use wider stencil openings and place them farther away (alternate paste openings placement):

Stencil and land pattern comparison:

All drawings/photos in this answer are made by me.

Standard 0.5mm-pitch LQFP stencil paste openings are pretty thin. From my experience, solder paste is often smeared during stencil removal and manual component placement. Here is my modified land pattern / stencil configuration for solder bridging prevention (usable only for reflow soldering): Paste shrink: 0mm Mask swell: 0.05mm Distance between pad centers are the same as standard LQFP48/64/100 (see STM32 datasheet).

Idea is to use wider stencil openings and place them farther away (alternate paste openings placement):

Stencil and land pattern comparison:

All drawings/photos in this answer are made by me. Pdf summary: https://www.thundertronics.com/Modified%20LQFP%20land%20pattern%20for%20solder%20bridging%20prevention.pdf

Standard 0.5mm-pitch LQFP stencil paste openings are pretty thin. From my experience, solder paste is often smeared during stencil removal and manual component placement. Here is modified land pattern / stencil configuration for solder bridging prevention (usable only for reflow soldering): Paste shrink: 0mm Mask swell: 0.05mm Distances between pad centers are the same as standard LQFP48/64/100 (see STM32 datasheet).

Idea is to use wider stencil openings and place them farther away (alternate paste openings placement):

Stencil and land pattern comparison:

All drawings/photos in this answer are made by me. Pdf summary: https://www.thundertronics.com/Modified%20LQFP%20land%20pattern%20for%20solder%20bridging%20prevention.pdf

Standard 0.5mm-pitch LQFP stencil paste openings are pretty thin. From my experience, solder paste is often smeared during stencil removal and manual component placement. Here is my modified land pattern / stencil configuration for solder bridging prevention (usable only for reflow soldering): Paste shrink: 0mm Mask swell: 0.05mm Distance between pad centers are the same as standard LQFP48/64/100 (see STM32 datasheet).

Idea is to use wider stencil openings and place them farther away (alternate paste openings placement):

Stencil and land pattern comparison:

All drawings/photos in this answer are made by me. Pdf summary: https://thundertronics.com/Modified%20LQFP%20land%20pattern%20for%20solder%20bridging%20prevention.pdf

Standard 0.5mm-pitch LQFP stencil paste openings are pretty thin. From my experience, solder paste is often smeared during stencil removal and manual component placement. Here is my modified land pattern / stencil configuration for solder bridging prevention (usable only for reflow soldering): Paste shrink: 0mm Mask swell: 0.05mm Distance between pad centers are the same as standard LQFP48/64/100 (see STM32 datasheet).

Idea is to use wider stencil openings and place them farther away (alternate paste openings placement):

Stencil and land pattern comparison:

All drawings/photos in this answer are made by me. Pdf summary: https://www.thundertronics.com/Modified%20LQFP%20land%20pattern%20for%20solder%20bridging%20prevention.pdf