Timeline for Is there a rule of thumb or an IPC standard for reducing (windowing) solder paste deposition on exposed pads?
Current License: CC BY-SA 4.0
8 events
| when toggle format | what | by | license | comment | |
|---|---|---|---|---|---|
| Feb 21, 2023 at 17:33 | vote | accept | JYelton | ||
| Dec 22, 2022 at 2:22 | answer | added | qrk | timeline score: 0 | |
| Dec 22, 2022 at 1:46 | answer | added | Spehro 'speff' Pefhany | timeline score: 1 | |
| Dec 22, 2022 at 1:15 | history | edited | JYelton | CC BY-SA 4.0 |
Added exposed pad dimensions even though they are not required for the answer.
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| Dec 21, 2022 at 23:42 | answer | added | Kuba hasn't forgotten Monica | timeline score: 3 | |
| Dec 21, 2022 at 23:34 | comment | added | JYelton | @ElectronicsStudent That's what I usually do for standard packages, but I asked the question because I wanted to know if there are guidelines when such options aren't readily available. (Granted, that's not often, but I am still curious.) | |
| Dec 21, 2022 at 23:10 | comment | added | ElectronicsStudent | So if its standard 24 4x4 QFN or 5x5 just use the parametric search on mouser/digikey and scan different datasheets for advise. Or go to one of the major IC-manufacturers (TI, Maxim, NS, etc. ) website and browse their documentation - usually they will allow searches for specific package-types. Or ask your assembler. They will know and maybe even have detailed drawings/recommenations based on real-world experience. | |
| Dec 21, 2022 at 22:34 | history | asked | JYelton | CC BY-SA 4.0 |