It's kind of hard to find any decent solder for hand soldering without a rosin flux core. Also I wouldn't really call "SOIC, SSOP, SOT" fine pitch, these are typically 1.27mm/0.05'' or larger. You should be able to solder these without any problems at all using standard practices and no external flux.
However, 0.7mm solder is used for soldering elephants! :) That's way too thick still, you must use 0.25mm or thinner when dealing with fine pitch. The most common mistake by far when doing SMD by hand seems to be too much solder. Use some RoHS solder with "no clean" rosin core flux.
As for actual fine pitch (0.65mm or smaller), there's basically 3 different hand soldering techniques:
- Pin by pin. I posted some advise for the first one of these here: https://electronics.stackexchange.com/a/502238/6102, with 0.5mm pitch QFP as the example.
- "All at once", which means align the part and solder outer pins as told in my link above, but then just spam lots of solder all along one side of the part. This will typically work very poorly just with the rosin core flux - you will get bridges all over the place. Those who use this technique use external flux and anything else is not advised.
- Solder hot air + paste. This is obviously a different story entirely, but here too you'll probably want external flux and applied in advance. (And a solder hot air station with temperature and air flow control, not some generic heat gun that you use for shrink tubes!) This is about the only way to hand solder heat pads, QFN and BGA by hand too, though a reflow oven is obviously what's recommended for such parts.
No matter method, external flux is highly recommended for cleaning up bridges or when removing small solder blobs.