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A die is a small block of semiconducting material on which a given functional integrated circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut (“diced”) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die.

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Using decapped ICs in production

(Where you remove the top and passivation layer and then put probe needles on the die) The decapping is done with special hot-acid pump and a special rubber 'window'. … The bond wires where still there, so no clean die. You could try throwing a bundle of chips in boiling acid and see what comes out. But my guess is the bond pads will not be usable anymore. …
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