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This is the first time I am making a high speed PCB so I am a bit unconfident. the ic I am talking about is this https://ftdichip.com/wp-content/uploads/2020/07/DS_FT2232H.pdf

I have followed the schematic in the datasheet above and I have placed the capacitors and inductors close to the ic and I think I have given enough clearance to the traces.

I am planning to use a top layer polygon pour around the ic to make routing easier. Is this a better alternative to using vias?

edit: Should I just add an extra 1 or 2 layers and make one of them ground (just using 2 layers currently)?

This is the first time I am making a high speed PCB so I am a bit unconfident. the ic I am talking about is this: FTDI232H

I have followed the schematic in the datasheet above and I have placed the capacitors and inductors close to the ic and I think I have given enough clearance to the traces.

I am planning to use a top layer polygon pour around the ic to make routing easier. Is this a better alternative to using vias?

edit: Should I just add an extra 1 or 2 layers and make one of them ground (just using 2 layers currently)?

This is the first time I am making a high speed PCB so I am a bit unconfident. the ic I am talking about is this https://ftdichip.com/wp-content/uploads/2020/07/DS_FT2232H.pdf

I have followed the schematic in the datasheet above and I have placed the capacitors and inductors close to the ic and I think I have given enough clearance to the traces.

I am planning to use a top layer polygon pour around the ic to make routing easier. Is this a better alternative to using vias?

edit: Should I just add an extra 1 or 2 layers and make one of them ground?

This is the first time I am making a high speed PCB so I am a bit unconfident. the ic I am talking about is this https://ftdichip.com/wp-content/uploads/2020/07/DS_FT2232H.pdf

I have followed the schematic in the datasheet above and I have placed the capacitors and inductors close to the ic and I think I have given enough clearance to the traces.

I am planning to use a top layer polygon pour around the ic to make routing easier. Is this a better alternative to using vias?

edit: Should I just add an extra 1 or 2 layers and make one of them ground (just using 2 layers currently)?

This is the first time I am making a high speed PCB so I am a bit unconfident. the ic I am talking about is this https://ftdichip.com/wp-content/uploads/2020/07/DS_FT2232H.pdf

I have followed the schematic in the datasheet above and I have placed the capacitors and inductors close to the ic and I think I have given enough clearance to the traces.

I am planning to use a top layer polygon pour around the ic to make routing easier. Is this a better alternative to using vias?

This is the first time I am making a high speed PCB so I am a bit unconfident. the ic I am talking about is this https://ftdichip.com/wp-content/uploads/2020/07/DS_FT2232H.pdf

I have followed the schematic in the datasheet above and I have placed the capacitors and inductors close to the ic and I think I have given enough clearance to the traces.

I am planning to use a top layer polygon pour around the ic to make routing easier. Is this a better alternative to using vias?

edit: Should I just add an extra 1 or 2 layers and make one of them ground?