I'm currently designing a IoT device based on an ESP32. This one comes on a mainboard where HAT could be plugged in (nothing new here).
The current HAT I'm working on is a temperature and humidity sensor board with either an HTU21 or HTU31D (the I2C version of the 2 ICs).
The overall PCB is working fine except for the measurements part (which is quite annoying for a temperature and humidity sensor). As soon as the MCU is warming up a bit, the HTU21 get all that heat and thus the measurement is not accurate at all (in regard of an old analog thermometer).
The 2 PCBs are mounted like so :
I followed up the design recommendation of the HTU21D by designing a notch around the sensor and removing any copper plane on the sensor island. The only thing that I did not remove is the thermal pad below it.
The PCBs have been manufactured using Aisler and are 1.6mm 4L PCB.
I'm currently planning to make a second batch of the PCB but in 0.8mm 4L PCB (but with JLC) but I would like to know if someone had advices about this and how I could avoid thermal influence of ESP.
I also think about moving the sensor on a separate PCB but I would like to keep the number of PCB as low as possible for the final assembly to reduce cost.
I'm building up this as a project for my company (I'm a freelancer as secondary job) and It supposed to be fully open source but I'm struggling a bit right now. (I should open a public repo for this I want the design to be fully fixed before doing so, I don't want people to have so issues while doing the same mistakes as me).