I have a hybrid PCB where I want to assemble a very thin steel foil on a PCB using standard pick and place SMT process. the picture below describe how the foil is like:
The orange area is only hold by fine traces and therefore can swing, and we want it to swing using a passive placed on a second castellation PCB assembled on top (passive in red). Is it a standard practice (at least 50% of PCBA facilities can do without problem) to pick and place the castellation PCB while making the orange area move down?
If yes, do you think it,s possible to do standard, or we should use some kind of smt adhesive to hold the castellation PCB and avoid it being pushed up by the orange membrane?
passive
? \$\endgroup\$assemble steel standard
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