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I have a hybrid PCB where I want to assemble a very thin steel foil on a PCB using standard pick and place SMT process. the picture below describe how the foil is like: enter image description here

enter image description here

The orange area is only hold by fine traces and therefore can swing, and we want it to swing using a passive placed on a second castellation PCB assembled on top (passive in red). Is it a standard practice (at least 50% of PCBA facilities can do without problem) to pick and place the castellation PCB while making the orange area move down?

If yes, do you think it,s possible to do standard, or we should use some kind of smt adhesive to hold the castellation PCB and avoid it being pushed up by the orange membrane?

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    \$\begingroup\$ what is a passive ? \$\endgroup\$
    – jsotola
    Commented Jan 31, 2018 at 2:11
  • \$\begingroup\$ what does this mean? assemble steel standard \$\endgroup\$
    – jsotola
    Commented Jan 31, 2018 at 2:13
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    \$\begingroup\$ Why do you care whether >50% of manufacturers are able to do it? Wouldn't it be more relevant either whether your manufacturer can do it, or where you can find one that can? \$\endgroup\$ Commented Jan 31, 2018 at 2:14
  • \$\begingroup\$ @jsotola: a passive means a capacitor, resistor, simple pin, anything simple not powered, "assemble steel standard" means no special process or extra cost is involved with soldering steel on HASL or ENIG pads using solder paste \$\endgroup\$ Commented Jan 31, 2018 at 2:46
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    \$\begingroup\$ @immibis it's important because that way I know it won't be very expensive and if things go wrong for a reason or another with my manufacturer I still can find another fast enough and not struggle to rebuild the entire process from scratch \$\endgroup\$ Commented Jan 31, 2018 at 2:46

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