The current design uses a Micro B connector for the USB 3.0 connectivity. Unfortunately, this connector is susceptible to mechanical stress if the PCB is not handle with care, which results in ripped pads rendering the board unusable. I decided to replace it in the next revision with a Type B connector, which is THT, thus providing greater mechanical support.
The PCB is a 4-layer, in which all of the high-speed signals are located on the top layer. I have never used a THT component or VIAs for high-speed signals before. Is there anything I should consider or I just proceed with it? Also, we tend to hand solder the PCBs since it's a low production volume, with solder paste and hot air for SMT and iron for THT components on the board. Do you solder the USB 3.0 connector with the soldering iron as any other THT component, or is there anything special about handling a high-speed THT connector? Thank you.
Edit:
Although I will probably go with the solution proposed by Maple below, I am still interested to know the answer to my questions regarding Type B connector.