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A die is a small block of semiconducting material on which a given functional integrated circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut (“diced”) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die.

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Using decapped ICs in production

This includes WLP Wafer Level Packged parts, which is pretty close to bare die, but just a little bit nicer to deal with. …
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When should bare die be used instead of QFN/BGA packages?

Bare die on PCB is sometimes used on consumer goods in high volume, but there are steep setup costs. … And wire bonding (welding) from die to leadframe or from die to PCB requires special wire bonding equipment. …
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