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Mitu Raj
Mitu Raj
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I have a four layered PCB with two major high frequency component placed on the top layer. One is jn5169JN5169 and other is SE2431l (front end module), both operate in GHz. While evaluating the circuit (with the help of gerber file) I noticed a long trace and I have studied that long traces would add to EMI. 

Will it be a good practice if the SE2431l was placed on bottom layer and jn5169JN5169 on top and both connected through vias? But I have also read that when dealing with high frequency components vias should be avoided as it would lead to impedance mismatch and hence would lead to EMI. 

So my question is what to prefer? My ultimate aim is to reduce the EMI on the board.

I have a four layered PCB with two major high frequency component placed on the top layer. One is jn5169 and other is SE2431l (front end module) both operate in GHz. While evaluating the circuit (with the help of gerber file) I noticed a long trace and I have studied that long traces would add to EMI. Will it be a good practice if the SE2431l was placed on bottom layer and jn5169 on top and both connected through vias? But I have also read that when dealing with high frequency components vias should be avoided as it would lead to impedance mismatch and hence would lead to EMI. So my question is what to prefer? My ultimate aim is to reduce the EMI on the board.

I have a four layered PCB with two major high frequency component placed on the top layer. One is JN5169 and other is SE2431l (front end module), both operate in GHz. While evaluating the circuit (with the help of gerber file) I noticed a long trace and I have studied that long traces would add to EMI. 

Will it be a good practice if the SE2431l was placed on bottom layer and JN5169 on top and both connected through vias? But I have also read that when dealing with high frequency components vias should be avoided as it would lead to impedance mismatch and hence would lead to EMI. 

So my question is what to prefer? My ultimate aim is to reduce the EMI on the board.

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winny
winny
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placement Placement of components on pcbPCB

I have a four layered pcbPCB with two major high frequency component placed on the top layer. oneOne is jn5169 and other is SE2431l (front end module) both operate in GHZGHz.while While evaluating the circuit (with the help of gerber file) iI noticed a long trace and iI have studied that long traces would add to emi EMI. Will itit be a good practice if the SE2431l was placed on bottom layer and jn5169 on top and both connected through vias.? But I have also read that when dealing with high frequency components vias should be avoided as it would lead to impedance mismatch and hence would lead to emiEMI.so So my question is what to prefer  ? myMy ultimate aim is to reduce the emiEMI on the board.

placement of components on pcb

I have a four layered pcb with two major high frequency component placed on the top layer. one is jn5169 and other is SE2431l (front end module) both operate in GHZ.while evaluating the circuit (with the help of gerber file) i noticed a long trace and i have studied that long traces would add to emi . Will it be a good practice if the SE2431l was placed on bottom layer and jn5169 on top and both connected through vias. But I have also read that when dealing with high frequency components vias should be avoided as it would lead to impedance mismatch and hence would lead to emi.so my question is what to prefer  ? my ultimate aim is to reduce the emi on the board.

Placement of components on PCB

I have a four layered PCB with two major high frequency component placed on the top layer. One is jn5169 and other is SE2431l (front end module) both operate in GHz. While evaluating the circuit (with the help of gerber file) I noticed a long trace and I have studied that long traces would add to EMI. Will it be a good practice if the SE2431l was placed on bottom layer and jn5169 on top and both connected through vias? But I have also read that when dealing with high frequency components vias should be avoided as it would lead to impedance mismatch and hence would lead to EMI. So my question is what to prefer? My ultimate aim is to reduce the EMI on the board.

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Akanksha Upadhyay
Akanksha Upadhyay
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placement of components on pcb

I have a four layered pcb with two major high frequency component placed on the top layer. one is jn5169 and other is SE2431l (front end module) both operate in GHZ.while evaluating the circuit (with the help of gerber file) i noticed a long trace and i have studied that long traces would add to emi . Will it be a good practice if the SE2431l was placed on bottom layer and jn5169 on top and both connected through vias. But I have also read that when dealing with high frequency components vias should be avoided as it would lead to impedance mismatch and hence would lead to emi.so my question is what to prefer ? my ultimate aim is to reduce the emi on the board.