I've been designing boards mainly using 0402s. I can hand solder 0402s all day with a microscope and some tweezers. Our passive supplier (a random Chinese passive company) has told us to get ready to switch to 0201s. They are going to phase out 0402s, in a year.
We are starting work on an IoT device, and this device is going to be going in front of venture capital folks to drum up investor money. This seems like the kind of device we need to look at 0201s and GULP 01005s.
I understand more expensive chip-shooters are rated for smaller components, but that is no guarantee of real world results, 01005s are soo tiny...
Ignoring any cost differences, has anyone noticed a significant decrease in board yields when moving to smaller parts?
Can anyone who has moved boards over to 0201s and 01005s provide any anecdotal evidence on how their production yields were affected by moving to such small pats from 0402s?
Get ready to replace those 01005s by hand, fun times...!